Abstract: A lithographic apparatus in which a size and/or a position of features formed on a substrate are adjusted by adjusting an intensity of radiation at boundaries of pattern features.

Abstract: A lithography apparatus including a projection system configured to project a beam of radiation as an array of sub-beams of radiation and an array of individually controllable elements configured to modulate the sub-beams of radiation to form a requested dose pattern on a substrate. The requested dose pattern is built up over time from an array of localized exposures in which at least neighboring localized exposures are imaged at substantially different times and in which each localized exposure is produced by one of the sub-beams of radiation. The lithography apparatus also includes a rasterizer device arranged to convert data defining the requested dose pattern to a sequence of data representing the requested dose at a corresponding sequence of points within the pattern, and also a data manipulation device arranged to receive the sequence of data and constitute a control signal suitable for controlling the array of individually controllable elements.