Abstract: A process for the formation of a patterned resist of a photocurable material on a circuit board, the uncured portion of which is water soluble. The process includes the steps of forming a layer of an aqueous emulsion of a photocurable material upon the circuit board, drying the layer to a substantially dry and non-tacky state, imagewise exposing the layer to radiation to cure portions of the layer exposed to the radiation, and removing unexposed portions of the layer by washing with water. In a preferred embodiment, the photocurable material is an organic solvent solution of an epoxy acrylate derived from an epoxy novolac resin which has been carboxylated to render it alkali-developable.

Abstract: A two-part system for the preparation of a thermally curable coating composition, in which one-pack contains a thermally curable material and the other contains a curing system potentially reactive therewith, at least one of the packs having water as the principal liquid carrier.