Patents by Inventor Wu An-hsiang

Wu An-hsiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240164569
    Abstract: An automated beverage preparation apparatus includes: multiple pumps for extracting multiple fluid materials stored in multiple material containers, and pushing the extracted fluid materials to move forward; a fluid output device coupled with the multiple pumps and arranged to operably dispense fluid materials to a beverage container; a user control interface arranged to operably generate a control command; a processing circuit arranged to operably generate a corresponding control signal according to the control command; and a pump control circuit arranged to operably control the multiple pumps according to the control signal. The pump control circuit conducts a layered drink making operation under control of the processing circuit to cause the fluid output device to dispense different fluid materials to the beverage container, so as to automatically form a layered drink/gradient drink having at least two color layers within the beverage container.
    Type: Application
    Filed: January 19, 2023
    Publication date: May 23, 2024
    Applicant: Botrista Technology, Inc.
    Inventors: Yung-Hsiang CHANG, Wu-Chou KUO, Kuan-Chang PAN, Kai-Chung HSU, Jhih-Sheng JHANG
  • Publication number: 20240166486
    Abstract: An automated beverage preparation apparatus includes: multiple pumps for extracting multiple fluid materials stored in multiple material containers, and pushing the extracted fluid materials to move forward; a fluid output device coupled with the multiple pumps and arranged to operably dispense fluid materials to a beverage container; a user control interface arranged to operably generate a control command; a processing circuit arranged to operably generate a corresponding control signal according to the control command; and a pump control circuit arranged to operably control the multiple pumps according to the control signal. The pump control circuit conducts a sparkling drink making operation under control of the processing circuit to cause the fluid output device to dispense different fluid materials to the beverage container in order, so as to automatically form a sparkling drink/aerated drink with a predetermined flavor within the beverage container.
    Type: Application
    Filed: January 19, 2023
    Publication date: May 23, 2024
    Applicant: Botrista Technology, Inc.
    Inventors: Yung-Hsiang CHANG, Wu-Chou KUO, Kuan-Chang PAN, Kai-Chung HSU, Jhih-Sheng JHANG
  • Patent number: 11961770
    Abstract: Some embodiments of the present disclosure relate to a processing tool. The tool includes a housing enclosing a processing chamber, and an input/output port configured to pass a wafer through the housing into and out of the processing chamber. A back-side macro-inspection system is arranged within the processing chamber and is configured to image a back side of the wafer. A front-side macro-inspection system is arranged within the processing chamber and is configured to image a front side of the wafer according to a first image resolution. A front-side micro-inspection system is arranged within the processing chamber and is configured to image the front side of the wafer according to a second image resolution which is higher than the first image resolution.
    Type: Grant
    Filed: November 4, 2021
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chia-Han Lin, Chien-Fa Lee, Hsu-Shui Liu, Jiun-Rong Pai, Sheng-Hsiang Chuang, Surendra Kumar Soni, Shou-Wen Kuo, Wu-An Weng, Gary Tsai, Chien-Ko Liao, Ya Hsun Hsueh, Becky Liao, Ethan Yu, Ming-Chi Tsai, Kuo-Yi Liu
  • Patent number: 8211968
    Abstract: The present invention relates to plasticized polyolefin compositions comprising a polyolefin and a non-functionalized hydrocarbon plasticizer.
    Type: Grant
    Filed: January 25, 2010
    Date of Patent: July 3, 2012
    Assignee: ExxonMobil Chemical Patents Inc.
    Inventors: Henry Wu-Hsiang Yang, Wen Li, Bruce R. Lundmark, Chon-Yie Lin, Chia Yung Cheng, Bryan R. Chapman, Petra Eiselt, Galina Ourieva, Manika Varma-Nair, James N. Coffey, Sandra Denise Schregenberger, David J. Lohse, Norman Yang, Jeffrey Theodore Zudock, Robert Jay Wittenbrink
  • Patent number: 7787491
    Abstract: Methods and systems for a synchronizable E-VSB enhanced data interleaving and data expansion are disclosed. Aspects of one method may include a packet processor that may generate valid output when a portion of the packet processor may initially contain invalid data. The packet processor may generate the valid data after detecting that storage elements within an interleaver integrated within the packet processor may be filled with valid data received from input, and that a byte output by the interleaver may be a first byte among the bytes in the interleaver that may be part of a new VBS field.
    Type: Grant
    Filed: August 25, 2006
    Date of Patent: August 31, 2010
    Assignee: Broadcom Corporation
    Inventor: Wu-Hsiang Chen
  • Publication number: 20100152346
    Abstract: The present invention relates to plasticized polyolefin compositions comprising a polyolefin and a non-functionalized hydrocarbon plasticizer.
    Type: Application
    Filed: January 25, 2010
    Publication date: June 17, 2010
    Inventors: Henry Wu-Hsiang Yang, Wen Li, Bruce R. Lundmark, Chon-Yie Lin, Chia Yung Cheng, Bryan R. Chapman, Petra Eiselt, Galina Ourieva, Manika Varma-Nair, James N. Coffey, Sandra Denise Schregenberger, David J. Lohse, Norman Yang, Jeffrey Theodore Zudock, Robert Jay Wittenbrink
  • Patent number: 7652094
    Abstract: The present invention relates to plasticized polyolefin compositions comprising a polyolefin and a non-functionalized plasticizer; wherein the non-functionalized plasticizer may comprise C6 to C200 paraffins (including branched and normal paraffins) having a pour point of less than ?5° C. In one embodiment, the non-functionalized plasticizer is an isoparaffin comprising C6 to C25 isoparaffins. In another embodiment the non-functionalized plasticizer is a polyalphaolefin comprising C10 to C100 n-paraffins. The polyolefin may be a polypropylene homopolymer, copolymer, impact copolymer, or blends thereof, and may include a plastomer. Non-limiting examples of desirable article of manufacture made from compositions of the invention include films, tubes, pipes, sheets, fibers, woven and nonwoven fabrics, automotive components, furniture, sporting equipment, food storage containers, transparent and semi-transparent articles, toys, tubing and pipes, and medical devices.
    Type: Grant
    Filed: May 12, 2006
    Date of Patent: January 26, 2010
    Assignee: ExxonMobil Chemical Patents Inc.
    Inventors: Chon Yie Lin, Chia Yung Cheng, Henry Wu-Hsiang Yang
  • Patent number: 7652093
    Abstract: The present invention relates to plasticized polyolefin compositions comprising a polyolefin and a non-functionalized hydrocarbon plasticizer.
    Type: Grant
    Filed: April 19, 2006
    Date of Patent: January 26, 2010
    Assignee: ExxonMobil Chemical Patents Inc.
    Inventors: Henry Wu-Hsiang Yang, Wen Li, Bruce R. Lundmark, Chon-Yie Lin, Chia Yung Cheng, Bryan R. Chapman, Petra Eiselt, Galina Ourieva, Manika Varma-Nair, James N. Coffey, Sandra Denise Schregenberger, David J. Lohse, Norman Yang, Jeffrey Theodore Zudock, Robert Jay Wittenbrink
  • Patent number: 7632887
    Abstract: The present invention relates to plasticized polyolefin compositions comprising a polyolefin and a non-functionalized plasticizer; wherein the non-functionalized plasticizer may comprise C6 to C200 paraffins (including branched and normal paraffins) having a pour point of less than ?5° C. In one embodiment, the non-functionalized plasticizer is an isoparaffin comprising C6 to C25 isoparaffins. In another embodiment the non-functionalized plasticizer is a polyalphaolefin comprising C10 to C100 n-paraffins. The polyolefin may be a polypropylene homopolymer, copolymer, impact copolymer, or blends thereof, and may include a plastomer. Non-limiting examples of desirable article of manufacture made from compositions of the invention include films, tubes, pipes, sheets, fibers, woven and nonwoven fabrics, automotive components, furniture, sporting equipment, food storage containers, transparent and semi-transparent articles, toys, tubing and pipes, and medical devices.
    Type: Grant
    Filed: August 4, 2003
    Date of Patent: December 15, 2009
    Assignee: ExxonMobil Chemical Patents Inc.
    Inventors: Chon Yie Lin, Chia Yung Cheng, Henry Wu-Hsiang Yang
  • Patent number: 7619026
    Abstract: The present invention relates to plasticized polyolefin compositions comprising a polyolefin and a non-functionalized hydrocarbon plasticizer.
    Type: Grant
    Filed: August 12, 2003
    Date of Patent: November 17, 2009
    Assignee: ExxonMobil Chemical Patents Inc.
    Inventors: Henry Wu-Hsiang Yang, Wen Li, Bruce R. Lundmark, Chon-Yie Lin, Chia Yung Cheng, Bryan R. Chapman, Petra Eiselt, Galina Ourieva, Manika Varma-Nair, James N. Coffey, Sandra Denise Schregenberger, David J. Lohse, Norman Yang, Jeffrey Theodore Zudock, Robert Jay Wittenbrink
  • Publication number: 20090171001
    Abstract: The present invention relates to articles made from plasticized polyolefin compositions comprising a polyolefin and a non-functionalized hydrocarbon plasticizer.
    Type: Application
    Filed: February 25, 2009
    Publication date: July 2, 2009
    Inventors: Chon-Yie Lin, Wen Li, Bryan R. Chapman, Michael B. Kelly, Bruce R. Lundmark, David J. Lohse, Henry Wu-Hsiang Yang, Sandra Denise Schregenbeger
  • Patent number: 7531594
    Abstract: The present invention relates to articles made from plasticized polyolefin compositions comprising a polyolefin and a non-functionalized hydrocarbon plasticizer.
    Type: Grant
    Filed: February 19, 2004
    Date of Patent: May 12, 2009
    Assignee: ExxonMobil Chemical Patents Inc.
    Inventors: Chon-Yie Lin, Wen Li, Bryan R. Chapman, Michael B. Kelly, Bruce R. Lundmark, David J. Lohse, Henry Wu-Hsiang Yang, Sandra Denise Schregenberger
  • Publication number: 20080063089
    Abstract: Methods and systems for a synchronizable E-VSB enhanced data interleaving and data expansion are disclosed. Aspects of one method may include a packet processor that may generate valid output when a portion of the packet processor may initially contain invalid data. The packet processor may generate the valid data after detecting that storage elements within an interleaver integrated within the packet processor may be filled with valid data received from input, and that a byte output by the interleaver may be a first byte among the bytes in the interleaver that may be part of a new VBS field.
    Type: Application
    Filed: August 25, 2006
    Publication date: March 13, 2008
    Inventor: Wu-Hsiang Chen
  • Publication number: 20040260001
    Abstract: The present invention relates to articles made from plasticized polyolefin compositions comprising a polyolefin and a non-functionalized hydrocarbon plasticizer.
    Type: Application
    Filed: February 19, 2004
    Publication date: December 23, 2004
    Inventors: Chon-Yie Lin, Wen Li, Bryan R. Chapman, Michael B. Kelly, Bruce R. Lundmark, David J. Lohse, Henry Wu-Hsiang Yang, Sandra Denise Schregenberger
  • Publication number: 20040106723
    Abstract: The present invention relates to plasticized polyolefin compositions comprising a polyolefin and a non-functionalized hydrocarbon plasticizer.
    Type: Application
    Filed: August 12, 2003
    Publication date: June 3, 2004
    Inventors: Henry Wu-Hsiang Yang, Wen Li, Bruce R. Lundmark, Chon-Yie Lin, Chia Yung Cheng, Bryan R. Chapman, Petra Eiselt, Galina Ourieva, Manika Varma-Nair, James N. Coffey, Sandra Denise Schregenberger, David J. Lohse, Norman Yang, Jeffrey Theodore Zudock, Robert Jay Wittenbrink
  • Publication number: 20040054040
    Abstract: The present invention relates to plasticized polyolefin compositions comprising a polyolefin and a non-functionalized plasticizer; wherein the non-functionalized plasticizer may comprise C6 to C200 paraffins (including branched and normal paraffins) having a pour point of less than −5° C. In one embodiment, the non-functionalized plasticizer is an isoparaffin comprising C6 to C25 isoparaffins. In another embodiment the non-functionalized plasticizer is a polyalphaolefin comprising C10 to C100 n-paraffins. The polyolefin may be a polypropylene homopolymer, copolymer, impact copolymer, or blends thereof, and may include a plastomer. Non-limiting examples of desirable article of manufacture made from compositions of the invention include films, tubes, pipes, sheets, fibers, woven and nonwoven fabrics, automotive components, furniture, sporting equipment, food storage containers, transparent and semi-transparent articles, toys, tubing and pipes, and medical devices.
    Type: Application
    Filed: August 4, 2003
    Publication date: March 18, 2004
    Inventors: Chon Yie Lin, Chia Yung Cheng, Henry Wu-Hsiang Yang
  • Patent number: 6642554
    Abstract: A memory module structure of the invention is used for being assembled on a locking device. The memory module includes a substrate and a plurality of memories. The substrate has certain long sides and short sides. Notches are formed on the short sides for being secured by the locking device. Each of the plurality of memories has a suitable length and width. Some memories of the plurality of memories are transversely mounted on the substrate with respect to the substrate. The other memories of the plurality of memories are longitudinally mounted on the substrate with respect to the substrate. According to this structure, it is possible to suitably arrange a plurality of memories on the substrate so as to increase the memory capacity of the memory module.
    Type: Grant
    Filed: November 21, 2001
    Date of Patent: November 4, 2003
    Assignee: Kingpak Technology, Inc.
    Inventors: Nai Hua Yeh, Chen Pin Peng, Chief Lin, C. S. Cheng, Kuang Yu Fan, Ren Long Kau, Fu Yung Huang, Yves Huang, Wu Hsiang Lee, Chih Hsien Chung, May Chen
  • Patent number: 6627983
    Abstract: A stacked package structure of an image sensor for electrically connecting to a printed circuit board includes a first substrate, a second substrate, an integrated circuit, an image sensing chip, and a transparent layer. The second substrate is mounted on the first substrate so as to a cavity formed between the first substrate and second substrate. The integrated circuit is located within the cavity and electrically connected the first substrate. The image-sensing chip is arranged on the second substrate. The transparent layer covers over the image sensing chip, wherein the image sensing chip receives image signals via the transparent layer and transforms the image signals into electrical signals transmitted to the first substrate. Thus, the image sensing chip of the image sensing product and the integrated circuit can be integrally package.
    Type: Grant
    Filed: January 24, 2001
    Date of Patent: September 30, 2003
    Inventors: Hsiu Wen Tu, Wen Chuan Chen, Mon Nan Ho, Li Huan Chen, Nai Hua Yeh, Yen Cheng Huang, Yung Sheng Chiu, Jichen Wu, Joe Liu, Wu Hsiang Lee
  • Publication number: 20030094628
    Abstract: A memory module structure of the invention is used for being assembled on a locking device. The memory module includes a substrate and a plurality of memories. The substrate has certain long sides and short sides. Notches are formed on the short sides for being secured by the locking device. Each of the plurality of memories has a suitable length and width. Some memories of the plurality of memories are transversely mounted on the substrate with respect to the substrate. The other memories of the plurality of memories are longitudinally mounted on the substrate with respect to the substrate. According to this structure, it is possible to suitably arrange a plurality of memories on the substrate so as to increase the memory capacity of the memory module.
    Type: Application
    Filed: November 21, 2001
    Publication date: May 22, 2003
    Inventors: Nai Hua Yeh, Chen Pin Peng, Chief Lin, C.S. Cheng, Kuang Yu Fan, Ren Long Kau, Fu Yung Huang, Yves Huang, Wu Hsiang Lee, Chih Hsien Chung, May Chen
  • Publication number: 20020096753
    Abstract: A stacked package structure of an image sensor for electrically connecting to a printed circuit board includes a first substrate, a second substrate, an integrated circuit, an image sensing chip, and a transparent layer. The second substrate is mounted on the first substrate so as to a cavity formed between the first substrate and second substrate. The integrated circuit is located within the cavity and electrically connected the first substrate. The image-sensing chip is arranged on the second substrate. The transparent layer covers over the image sensing chip, wherein the image sensing chip receives image signals via the transparent layer and transforms the image signals into electrical signals transmitted to the first substrate.
    Type: Application
    Filed: January 24, 2001
    Publication date: July 25, 2002
    Inventors: Hsiu Wen Tu, Wen Chuan Chen, Mon Nan Ho, Li Huan Chen, Nai Hua Yeh, Yen Cheng Huang, Yung Sheng Chiu, Jichen Wu, Joe Liu, Wu Hsiang Lee