Patents by Inventor Wu Bing (Levin) Li

Wu Bing (Levin) Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Enclosure of anodized multi-layer metallic shell with molded plastic scaffolding and method of manufacture
    Patent number: 8681485
    Abstract: A device enclosure includes a clad metal shell having a plurality of mounting structures attached thereto. Methods for manufacturing the device enclosure are also disclosed. In a particular method, the mounting structures are formed on a surface of the clad metal shell by nano molding technology. Alternatively, the mounting structures are formed by molding before being attached to the clad metal shell by an adhesive.
    Type: Grant
    Filed: December 22, 2010
    Date of Patent: March 25, 2014
    Assignee: Flextronics AP, LLC
    Inventors: Shouzhong (Alex) Du, Richard Dale Michonski, Jichen (Jeff) Qin, Wu Bing (Levin) Li, Suriaprakash Narotamo
  • Enclosure of anodized multi-layer metallic shell with molded plastic scaffolding and method of manufacture
    Publication number: 20110186455
    Abstract: A device enclosure includes a clad metal shell having a plurality of mounting structures attached thereto. Methods for manufacturing the device enclosure are also disclosed. In a particular method, the mounting structures are formed on a surface of the clad metal shell by nano molding technology. Alternatively, the mounting structures are formed by molding before being attached to the clad metal shell by an adhesive.
    Type: Application
    Filed: December 22, 2010
    Publication date: August 4, 2011
    Inventors: Shouzhong (Alex) Du, Richard Dale Michonski, Jichen (Jeff) Qin, Wu Bing (Levin) Li, Suriaprakash Narotamo
  • System and method for overmolding of decorated plastic parts
    Publication number: 20110180294
    Abstract: An electronic device enclosure includes a first structural layer having a first surface and a second surface. A decorative feature is formed on the first surface of the first structural layer. The enclosure further includes a second structural layer, which is formed directly on the first surface of the first structural layer. The second structural layer is formed over the decorative feature by an overmolding process.
    Type: Application
    Filed: December 13, 2010
    Publication date: July 28, 2011
    Inventors: Jichen (Jeff) Qin, Charles R. Hill, Suriaprakash Narotamo, Wu Bing (Levin) Li, Spring Wu, Zhong Wang