Abstract: A heat exchanger is provided, including a first case, a second case, a substrate, an engaging structure, an evaporator, a condenser, a first tube, and a second tube. The first case includes a first plate structure and a first protruding structure. The first plate structure has a first inner surface. The first protruding structure protrudes from the first inner surface. The second case includes a second plate structure and a second protruding structure. The second plate structure has a second inner surface. The second protruding structure protrudes from the second inner surface. The substrate is engaged with the first inner surface, the first protruding structure, the second inner surface, and the second protruding structure via the engaging structure. The substrate is in contact with at least three different lateral surfaces of the engaging structure so that the substrate and the first case combine are bonded.

Abstract: Some embodiments of the present disclosure relate to a processing tool. The tool includes a housing enclosing a processing chamber, and an input/output port configured to pass a wafer through the housing into and out of the processing chamber. A back-side macro-inspection system is arranged within the processing chamber and is configured to image a back side of the wafer. A front-side macro-inspection system is arranged within the processing chamber and is configured to image a front side of the wafer according to a first image resolution. A front-side micro-inspection system is arranged within the processing chamber and is configured to image the front side of the wafer according to a second image resolution which is higher than the first image resolution.

Abstract: A portable electronic device including a first body, a second body, a stand, and a hinge structure is provided. The stand has a first pivot part and a second pivot part opposite to the first pivot part, wherein the first pivot part is pivotally connected to the first body, and the second body is pivotally connected to the second pivot part. The hinge structure includes a first bracket secured to the second body, a second bracket secured to the second pivot part of the stand, a first movable base, a first shaft secured to the first bracket and pivoted to the first movable base, a second movable base, a second shaft secured to the first movable base and pivoted to the second movable base, and a sliding shaft fixed to the second movable base and slidably connected to the second bracket.

Abstract: A heating apparatus with automatic switching heaters includes a control module, a switch module, and a heating module. The control module receives an input power source. The switch module is connected to the control module. The heating module is connected to the switch module. When the control module detects that an amplitude of the input power source is larger than a threshold voltage value, the control module turns on a first switch assembly and turns off a second switch assembly of the switch module so that the heating module operates in a first heating mode. When the control module detects that the amplitude of the input power source is less than the threshold voltage value, the control module turns on the first switch assembly and the second switch assembly of the switch module so that the heating module operates in a second heating mode.

Abstract: A heat exchange device includes a housing, a heat exchange module, and a piezoelectric module. Isolated inner and outer circulation chambers are formed in the housing. The heat exchange module in the housing includes a stack of separated plates parallel to each other. An inner channel communicated with the inner circulation chamber and an outer channel communicated with the outer circulation chamber are defined respectively by both sides of one of the plates and the other adjacent plates. The piezoelectric module in the housing includes a piezoelectric chip, and first and second heat exchange sides thermally coupled to the piezoelectric chip. The first heat exchange side is located in the inner circulation chamber and the second heat exchange side is located in the outer circulation chamber, so that heat can be transferred between the inner and outer circulation chambers via the piezoelectric chip.

Abstract: A heating apparatus with automatic switching heaters includes a control module, a switch module, and a heating module. The control module receives an input power source. The switch module is connected to the control module. The heating module is connected to the switch module. When the control module detects that an amplitude of the input power source is larger than a threshold voltage value, the control module turns on a first switch assembly and turns off a second switch assembly of the switch module so that the heating module operates in a first heating mode. When the control module detects that the amplitude of the input power source is less than the threshold voltage value, the control module turns on the first switch assembly and the second switch assembly of the switch module so that the heating module operates in a second heating mode.

Abstract: A heat exchange device includes a housing, a heat exchange module, and a piezoelectric module. Isolated inner and outer circulation chambers are formed in the housing. The heat exchange module in the housing includes a stack of separated plates parallel to each other. An inner channel communicated with the inner circulation chamber and an outer channel communicated with the outer circulation chamber are defined respectively by both sides of one of the plates and the other adjacent plates. The piezoelectric module in the housing includes a piezoelectric chip, and first and second heat exchange sides thermally coupled to the piezoelectric chip. The first heat exchange side is located in the inner circulation chamber and the second heat exchange side is located in the outer circulation chamber, so that heat can be transferred between the inner and outer circulation chambers via the piezoelectric chip.