Abstract: A method for marking chip scale packages at the wafer level is provided. First, a positioning step is performed to determine the position of a plurality of semi-finished chip scale packages formed on a wafer. Each of the semi-finished chip scale package includes a plurality of terminals for making external electrical connections and each die has a plurality of bonding pads on an active surface thereof. The bonding pads are electrically connected to the respective terminals wherein a backside surface of the die is exposed from a surface of the respective semi-finished chip scale package. The exposed backside surface of the die is then marked by ink-jet printing. Afterward, the ink marks on the dice are cured. Finally, the wafer is diced to obtain a plurality of separated chip scale packages.

Abstract: A communication device is provided with a ball turned by hand to reflect a laser beam within a housing. The laser beam proceeding within the housing is in response to motion of the ball and received by a light sensor. The communication device is capable of operation without providing a panel for the ball.

Abstract: The invention relates to an optical output system with auto optical power control for an optical mouse. The optical output system comprises: a light emitting device, a driver and an auto power controller. The light emitting device is used for generating emitting light. The driver is used for driving the light emitting device. The auto power controller is used for outputting a control signal to the driver according to at least one input signals so as to control the power of the light emitting device at a predetermined range. According to the invention, the optical output system can output the stable power of the emitting light at a predetermined value within the predetermined range under various conduction and circumference by a feedback control. Furthermore, the optical mouse using the optical output system can work on various reflective surface.

Abstract: The invention relates to an optical output system with auto optical power control for an optical mouse. The optical output system comprises: a light emitting device, a driver and an auto power controller. The light emitting device is used for generating emitting light. The driver is used for driving the light emitting device. The auto power controller is used for outputting a control signal to the driver according to at least one input signals so as to control the power of the light emitting device at a predetermined range. According to the invention, the optical output system can output the stable power of the emitting light at a predetermined value within the predetermined range under various conduction and circumference by a feedback control. Furthermore, the optical mouse using the optical output system can work on various reflective surface.

Abstract: The invention relates to a coordinate detecting method for a touch panel. Firstly, a plurality of X-axis and Y-axis I/O ports are converted to a plurality of X-axis and Y-axis scanning wires respectively by orthogonal method. Polling signals are transmitted to X-axis I/O ports, and are transmitted to the X-axis scanning wires. According to the polling signals, a plurality of X-axis detection signals are stored. A largest X-axis detection signal and a second largest X-axis detection signal are determined by compared method so as to calculate a X coordinate position of the sensor pen touching the touch panel. The steps are repeated to calculate the Y coordinate position of the sensor pen touching on the touch panel. According to the coordinate detecting method of the invention, the number of the I/O ports can be reduced, and the resolution of the touch panel can be improved.

Abstract: A method for forming an underfill layer on a bumped wafer is disclosed. A film is provided wherein the film includes a base layer, a removable layer and the underfill layer. The film is disposed on a bump wafer and then pressing the film under heating is performed to have the bumps of the wafer embedded in the underfill layer. Then, the removable layer with base film attached thereto is removed, so the underfill layer well encloses the bumps of the wafer and is easily separated from the base film layer and the removable layer without damaging the bumps formed on the wafer.

Abstract: A method for forming an underfill layer on a bumped wafer is disclosed. A film is provided wherein the film includes a base layer, a removable layer and the underfill layer. The film is disposed on a bump wafer and then pressing the film under heating is performed to have the bumps of the wafer embedded in the underfill layer. Then, the removable layer with base film attached thereto is removed, so the underfill layer well encloses the bumps of the wafer and is easily separated from the base film layer and the removable layer without damaging the bumps formed on the wafer.

Abstract: The invention relates to a coordinate detecting method for a touch panel. Firstly, a plurality of X-axis and Y-axis I/O ports are converted to a plurality of X-axis and Y-axis scanning wires respectively by orthogonal method. Polling signals are transmitted to X-axis I/O ports, and are transmitted to the X-axis scanning wires; According to the polling signals, a plurality of X-axis detection signals are stored. A largest X-axis detection signal and a second largest X-axis detection signal are determined by compared method so as to calculate a X coordinate position of the sensor pen touching the touch panel. The steps are repeated to calculate the Y coordinate position of the sensor pen touching on the touch panel. According to the coordinate detecting method of the invention, the number of the I/O ports can be reduced, and the resolution of the touch panel can be improved.

Abstract: A chip scale package includes a plurality of terminals for making external electrical connections and a chip. The chip has a plurality of bonding pads on an active surface thereof, and the bonding pads of the chip are electrically connected to the terminals. The backside surface of the chip is exposed from a surface of the package. The present invention is characterized by having an ink mark on the backside surface of the chip. The present invention further provides a method for making the chip scale package at the wafer level.