Patents by Inventor WU-FEI XU

WU-FEI XU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat dissipating device with improved cooling performance
    Patent number: 10108237
    Abstract: A heat dissipating device includes a first copper plate, a second copper plate, a plurality of first heat pipes, a plurality of second heat pipes, and a heat dissipating component. Evaporating sections of the first heat pipes and the second heat pipes are clamped between and thermally connected to the first copper plate and the second copper plate. The second heat pipe, the evaporating section of the first heat pipes, the first copper plate, and the second copper plate are positioned at a bottom surface of the heat dissipating component. The second copper plate is thermally connected to the bottom surface of the heat dissipating component. Condensing sections of the first heat pipes is thermally connected to a top surface of heat dissipating component.
    Type: Grant
    Filed: May 15, 2017
    Date of Patent: October 23, 2018
    Assignee: CHAMP TECH OPTICAL (FOSHAN) CORPORATION
    Inventors: Meng Fu, Qiao-Long Chen, Wu-Fei Xu
  • HEAT DISSIPATING DEVICE WITH IMPROVED COOLING PERFORMANCE
    Publication number: 20180292872
    Abstract: A heat dissipating device includes a first copper plate, a second copper plate, a plurality of first heat pipes, a plurality of second heat pipes, and a heat dissipating component. Evaporating sections of the first heat pipes and the second heat pipes are clamped between and thermally connected to the first copper plate and the second copper plate. The second heat pipe, the evaporating section of the first heat pipes, the first copper plate, and the second copper plate are positioned at a bottom surface of the heat dissipating component. The second copper plate is thermally connected to the bottom surface of the heat dissipating component. Condensing sections of the first heat pipes is thermally connected to a top surface of heat dissipating component.
    Type: Application
    Filed: May 15, 2017
    Publication date: October 11, 2018
    Inventors: MENG FU, QIAO-LONG CHEN, WU-FEI XU