Abstract: Semiconductor structure and method for fabricating a semiconductor structure are provided. A substrate including device regions and an isolation region located adjacent to and between the device regions is provided. A fin on the substrate, gate structures across the fin at the device regions, source/drain doped regions in the fin at two sides of each of the gate structures, and a sacrificial gate across the fin at the isolation region are provided. The sacrificial gate and a portion of the fin near a bottom of the sacrificial gate are removed, thus forming a first opening in the fin. An insulation structure in the first opening is formed. Two sides of the sacrificial gate are in contact with the source/drain doped regions at adjacent device regions. A top surface of the insulation structure is flush with or higher than top surfaces of the source/drain doped regions.

Abstract: The local dimming method includes: dividing a digital image into multiple blocks and calculating a backlight parameter of each of the blocks; performing a backlight simulation based on the backlight parameters to calculate source brightness of each pixel; quantifying the backlight parameters into multiple reference backlight parameters according to numerical ranges; performing the backlight simulation based on the reference backlight parameters to calculate reference source brightness of each pixel; for each of the pixels, setting a gain of the pixel to be less than or equal to a first value if the corresponding reference source brightness is equal to the darkest backlight parameter, otherwise determining the gain of the pixel according to a ratio of the source brightness to the reference source brightness; adjusting grey levels of the pixels according to the gains to obtain adjusted grey levels and driving the display panel according to the adjusted grey levels.

Abstract: A structured light projector and a method for structured light projection are disclosed. The structured light projector includes a projection module, a processor. The projection module is configured to project an optical pattern onto a region of space, and includes a light source, a diffractive optical element and a liquid crystal lens. The light source is configured to generate a light beam. The diffractive optical element is configured to convert the light beam into the optical pattern. The liquid crystal lens is interposed between the light source and the diffractive optical element, and is configured to collimate the light beam. The processor is configured to generate a control signal depending on an environment temperature of the projection module for controlling the liquid crystal lens.

Abstract: A structured light projector and a method for structured light projection are disclosed. The structured light projector includes a projection module, an image sensor and a processor. The projection module is configured to project an optical pattern onto a region of space. The image sensor is configured to capture an image by detecting the optical pattern projected onto the region of space. The processor is configured to calculate disparity information of the optical pattern projected onto the region of space from the captured image, and is configured to compensate for the disparity of depending on an environment temperature of the projection module.

Abstract: A structured light projector and a method for structured light projection are disclosed. The structured light projector includes a projection module, a liquid crystal (LC) lens and a processor. The projection module is configured to project an optical pattern. The (LC) lens module is disposed over the projection module, and is configured to focus the optical pattern onto a region of space. The processor is configured to generate a control signal depending on an environment temperature of the projection module for controlling the LC lens.

Abstract: An electrical connector is provided for a mating connector to be inserted thereto. The electrical connector includes an insulating body having a tongue, and multiple terminals. A middle grounding sheet is located between the terminals in upper and lower rows, and has at least one first through hole. Each of left and right sides of the middle grounding sheet has a latch slot and a notch. The insulating body has a first insulating post entering the first through hole and a second insulating post entering the notch. A dimension of the second insulating post is larger than a dimension of the first insulating post. A metal shell frames outside the insulating body to form an insertion space. A first clearance between a first protruding portion and a shielding casing of the mating connector is more than or equal to 0.001 mm and less than or equal to 0.0449 mm.

Abstract: Embodiments of a power stage with vertical integration for high-density, low-noise voltage regulators are described. In some embodiments, an Information Handling System (IHS) may include: a processor; and a multi-phase voltage regulator (VR) coupled to the processor, where the multi-phase VR comprises at least one power stage, and where the at least one power stage includes: a High-Side Field-Effect Transistor (HSFET) die mounted on a leadframe; a Low-Side FET (LSFET) die mounted on the leadframe; at least one decoupling capacitor mounted on the leadframe; and a driver circuit mounted on a clip, where the clip overlays at least a portion of the HSFET die and the LSFET die.

Abstract: A local dimming system adaptable to a backlight of a display includes a light shape imitation (LSI) unit that receives a pulse-width modulation (PWM) value and provides a profile data for each block of the backlight; a profile analysis unit that generates an analytic mean value according to the profile data; and a diffusion compensation unit that compares the analytic mean value with a target mean value and compensates the PWM value for light diffusion according to a result of the comparison, thereby generating a compensated PWM value.

Abstract: A motor driving circuit, an application device, and a motor braking method are provided. The driving circuit includes an inverter, a braking unit, and a MCU. The inverter is configured to drive a motor. The braking unit includes a sampling circuit, a discharge circuit, and a switch group. The MCU is connected to the sampling circuit, the discharge circuit, and the switch group, and is configured to control the sampling circuit to detect a voltage across the inverter and obtain a detected value when receiving the emergency signal, compare the detected value to a preset voltage or a preset voltage range, and transmit a control signal to activate the discharge circuit when the detected value is greater than the preset voltage or exceeds the preset voltage range.

Abstract: An electrical connector is provided for a mating connector to be inserted thereto. The electrical connector includes an insulating body having a tongue, and multiple terminals. A middle grounding sheet is located between the terminals in upper and lower rows, and has at least one first through hole. Each of left and right sides of the middle grounding sheet has a latch slot and a notch. The insulating body has a first insulating post entering the first through hole and a second insulating post entering the notch. A dimension of the second insulating post is larger than a dimension of the first insulating post. A metal shell frames outside the insulating body to form an insertion space. A first clearance between a first protruding portion and a shielding casing of the mating connector is more than or equal to 0.001 mm and less than or equal to 0.0449 mm.

Abstract: Semiconductor structure and method for fabricating a semiconductor structure are provided. A substrate including device regions and an isolation region located adjacent to and between the device regions is provided. A fin on the substrate, gate structures across the fin at the device regions, source/drain doped regions in the fin at two sides of each of the gate structures, and a sacrificial gate across the fin at the isolation region are provided. The sacrificial gate and a portion of the fin near a bottom of the sacrificial gate are removed, thus forming a first opening in the fin. An insulation structure in the first opening is formed. Two sides of the sacrificial gate are in contact with the source/drain doped regions at adjacent device regions. A top surface of the insulation structure is flush with or higher than top surfaces of the source/drain doped regions.

Abstract: An electrical connector includes an insulation body, at least one first terminal and at least one second terminal, and a middle grounding plate. The insulation body has a base and a tongue located in a front end of the base. The first terminal and the second terminal are arranged in the base in an upper row and a lower row, and exposed to an upper surface and a lower surface of the tongue. The middle grounding plate has a body portion fixed to the tongue, and located between the first terminal and the second terminal, the first terminal has a first front edge, the second terminal has a second front edge, and the first front edge, the second front edge and an edge in a front end of the body portion are located in a same vertical plane.

Abstract: An electrical connector includes: an insulating body, including a base and a tongue extending forward from the base, a shielding sheet; and at least one row of terminals accommodated in the insulating body and located at one side of the shielding sheet. A side of the tongue is provided with at least one groove. The shielding sheet is provided with a plate body and at least one extending portion located on a side of the plate body. The extending portion is provided at the side of the tongue, and includes a locking groove exposed from the groove and a bending portion exposed from the tongue. The bending portion is located in front of the plate body and is spaced from the plate body. Each terminals include a head portion embedded in the tongue. In a front-rear direction, each head portion is located between the bending portion and the plate body.

Abstract: A mating connector includes a plastic body, which has a main body and an insertion portion formed by extending forward from the main body. A mating space is concavely formed backward from a front end surface of the insertion portion. The insertion portion has a side wall located at a periphery of the mating space and running through the mating space to form at least two through-holes, and the two through-holes do not communicate with each other. A metal cover surrounds the plastic body and is fastened to the main body. A grounding sheet is located between the metal cover and the side wall. The grounding sheet has a body and at least two elastic portions formed by bending forward from the body. The body covers the side wall, and each of the elastic portions is accommodated in a corresponding through-hole and enters the mating space.

Abstract: An electrical connector used for mating a mating connector includes an insulation body having a base portion and a tongue extending from the base portion, terminals fixedly disposed in the base portion and grouped into an upper row and a lower row, and a middle shielding sheet embedded in the tongue and located between the upper and lower rows. The tongue has upper and lower surfaces arranged opposite to each other, and a front surface connected to the upper and lower surfaces. The upper and lower rows of terminals are exposed on the upper and lower, respectively. The middle shielding sheet has a front end surface extending out of the front surface, a slot formed on the front end surface, and a first projection portion extending into the slot, overlapping a central line of the middle shielding sheet along a longitudinal direction, and located behind the front surface.

Abstract: An electrical connector includes an insulation body. Multiple terminals are fixed on the insulation body in an upper row and a lower row. Each terminal has a soldering portion. The soldering portions are arranged in two rows in a front-rear direction. A middle shielding sheet is fixed on the insulation body, and has a planar plate portion. A baffle extends downward from a rear end of the plate portion and is located between the soldering portions in the two rows. The plate portion extends horizontally in a lateral direction to form a connecting portion, which is in front of the rear end of the plate portion. A rear edge of the connecting portion bends downward to form a leg. In the front-rear direction, a distance between the rear end of the plate portion and the rear edge of the connecting portion is greater than a width of the connecting portion.

Abstract: An electrical connector includes: an insulating body, including a base and a tongue extending forward from the base, a shielding sheet; and at least one row of terminals accommodated in the insulating body and located at one side of the shielding sheet. A side of the tongue is provided with at least one groove. The shielding sheet is provided with a plate body and at least one extending portion located on a side of the plate body. The extending portion is provided at the side of the tongue, and includes a locking groove exposed from the groove and a bending portion exposed from the tongue. The bending portion is located in front of the plate body and is spaced from the plate body. Each terminals include a head portion embedded in the tongue. In a front-rear direction, each head portion is located between the bending portion and the plate body.

Abstract: An electrical connector includes an insulation body having a base and a tongue located in a front end of the base, terminals arranged in upper and lower rows, and a middle grounding plate disposed in the base and extending to the tongue. Terminals in the upper and lower rows are arranged on upper and lower surfaces of the tongue, respectively. The middle grounding plate is located between the upper and lower rows of terminals, and having at least one first hole. An edge of each of two lateral sides of the middle grounding plate is inwardly depressed to form a first groove. The first hole is located between the two first grooves. The insulation body has a first insulation post and a second insulation post, the first insulation post protrudes into the first hole, and the second insulation post protrudes into the first grooves on the lateral sides.

Abstract: A method is provided for fabricating a semiconductor structure. The method includes providing a substrate having a dielectric layer formed on the substrate, where an opening is formed in the dielectric layer, and bottom of the opening exposes surface of the substrate. The method also includes forming a first metal layer over of the dielectric layer, where a temperature for forming the first metal layer is a first temperature. In addition, the method includes forming a second metal layer filling the opening, where a temperature for forming the second metal layer is a second temperature, and the second temperature is higher than the first temperature. Further, the method includes planarizing the second metal layer and the first metal layer until the top surface of the dielectric layer is exposed.

Abstract: An electrical connector includes an insulation body having a base portion and a tongue located at a front end of the base portion. Multiple terminals are fixed on the base portion and partially exposed from a surface of the tongue. An outer metal casing surrounds the base portion and the tongue and forms an insertion space receiving the tongue. The outer metal casing has a bottom wall and two side walls. Each side wall extends downward to form a stop wall. Each stop wall extends downward to form two soldering pins. The four soldering pins are arranged in two rows. A cushion block is located below the bottom wall and fixed on the two stop walls. Four protruding blocks are formed by protruding downward from a bottom surface of the cushion block. At least two of the protruding blocks are located disposed between the soldering pins in the two rows.