Patents by Inventor Wu-Han Jiang

Wu-Han Jiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6737663
    Abstract: An apparatus and a method for detecting the tilt angle of a wafer platform in a process machine, particularly in a medium density ion implanter. The apparatus and method can be used to accurately calibrate the zero-angle position of a wafer platform in the medium energy ion implanter. The apparatus includes a process chamber that has a cavity and a wafer platform therein, a window that is substantially transparent to laser energy mounted in a top wall of the chamber, and a laser emitter and receiver positioned outside the process chamber juxtaposed to the window for emitting a laser beam onto a wafer positioned on the wafer platform and receiving a reflected laser beam to determine a tilt angle of the wafer platform by the intensity of the reflected laser beam.
    Type: Grant
    Filed: May 22, 2002
    Date of Patent: May 18, 2004
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Hom-Chung Lin, Song-Yueha Lin, Hu-Li Sun, Chi-Fu Yu, Wu-Han Jiang
  • Publication number: 20030218144
    Abstract: An apparatus and a method for detecting the tilt angle of a wafer platform in a process machine, particularly in a medium density ion implanter. The apparatus and method can be used to accurately calibrate the zero-angle position of a wafer platform in the medium energy ion implanter. The apparatus includes a process chamber that has a cavity and a wafer platform therein, a window that is substantially transparent to laser energy mounted in a top wall of the chamber, and a laser emitter and receiver positioned outside the process chamber juxtaposed to the window for emitting a laser beam onto a wafer positioned on the wafer platform and receiving a reflected laser beam to determine a tilt angle of the wafer platform by the intensity of the reflected laser beam.
    Type: Application
    Filed: May 22, 2002
    Publication date: November 27, 2003
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Hom-Chung Lin, Song-Yueha Lin, Hu-Li Sun, Chi-Fu Yu, Wu-Han Jiang