Abstract: A memory module structure of the invention is used for being assembled on a locking device. The memory module includes a substrate and a plurality of memories. The substrate has certain long sides and short sides. Notches are formed on the short sides for being secured by the locking device. Each of the plurality of memories has a suitable length and width. Some memories of the plurality of memories are transversely mounted on the substrate with respect to the substrate. The other memories of the plurality of memories are longitudinally mounted on the substrate with respect to the substrate. According to this structure, it is possible to suitably arrange a plurality of memories on the substrate so as to increase the memory capacity of the memory module.

Abstract: A stacked package structure of an image sensor for electrically connecting to a printed circuit board includes a first substrate, a second substrate, an integrated circuit, an image sensing chip, and a transparent layer. The second substrate is mounted on the first substrate so as to a cavity formed between the first substrate and second substrate. The integrated circuit is located within the cavity and electrically connected the first substrate. The image-sensing chip is arranged on the second substrate. The transparent layer covers over the image sensing chip, wherein the image sensing chip receives image signals via the transparent layer and transforms the image signals into electrical signals transmitted to the first substrate. Thus, the image sensing chip of the image sensing product and the integrated circuit can be integrally package.

Abstract: A memory module structure of the invention is used for being assembled on a locking device. The memory module includes a substrate and a plurality of memories. The substrate has certain long sides and short sides. Notches are formed on the short sides for being secured by the locking device. Each of the plurality of memories has a suitable length and width. Some memories of the plurality of memories are transversely mounted on the substrate with respect to the substrate. The other memories of the plurality of memories are longitudinally mounted on the substrate with respect to the substrate. According to this structure, it is possible to suitably arrange a plurality of memories on the substrate so as to increase the memory capacity of the memory module.

Abstract: A stacked package structure of an image sensor for electrically connecting to a printed circuit board includes a first substrate, a second substrate, an integrated circuit, an image sensing chip, and a transparent layer. The second substrate is mounted on the first substrate so as to a cavity formed between the first substrate and second substrate. The integrated circuit is located within the cavity and electrically connected the first substrate. The image-sensing chip is arranged on the second substrate. The transparent layer covers over the image sensing chip, wherein the image sensing chip receives image signals via the transparent layer and transforms the image signals into electrical signals transmitted to the first substrate.

Abstract: A stacked package structure of an image sensor for electrically connecting to a printed circuit board includes a substrate, an integrated circuit, an image sensing chip, and a transparent layer. The substrate has a first surface and a second surface opposite to the first surface. The first surface is formed with signal input terminals. The second surface is formed with signal output terminals for electrically connecting the substrate to the printed circuit board. The integrated circuit is mounted on the first surface of the substrate and electrically connected to the signal input terminals of the substrate. The image sensing chip is located above the integrated circuit to form a stacked structure with the integrated circuit for electrically connecting to the signal input terminals of the substrate. The transparent layer covers the image sensing chip.

Abstract: An integrated circuit structure having an adhesive agent for adhering to a substrate includes a first surface and a second surface opposite to the first surface. The first surface is formed with a plurality of bonding pads for electrically connecting to the substrate and transmitting signals from the integrated circuit to the substrate. An adhesive agent, which is non-adhesive at the room temperature, is applied onto the second surface. The adhesive agent becomes adhesive under pressing/heating so as to adhere onto the substrate. According to the structure, the problems caused by the overflowed glue can be avoided, the manufacturing processes can be facilitated, and the yield can be improved.