Patents by Inventor Wu-Hsing HUANG

Wu-Hsing HUANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and system for supplying chemical liquid in semiconductor fabrication
    Patent number: 11004679
    Abstract: A method for dispensing photoresist over a semiconductor wafer is provided. The method includes moving a dispensing nozzle to a predetermined position where the longitudinal axis of the dispensing nozzle aligns with the central axis of the semiconductor wafer. The method further includes dispensing a chemical liquid over the semiconductor wafer via the dispensing nozzle. The method also includes dispensing a photoresist over the semiconductor wafer that is coated with the chemical liquid via the dispensing nozzle. During the dispensing of the chemical liquid and the photoresist, the dispensing nozzle stays in the predetermined position.
    Type: Grant
    Filed: January 31, 2018
    Date of Patent: May 11, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Wu-Hsing Huang, Chia-Hung Kao
  • METHOD AND SYSTEM FOR SUPPLYING CHEMICAL LIQUID IN SEMICONDUCTOR FABRICATION
    Publication number: 20190096665
    Abstract: A method for dispensing photoresist over a semiconductor wafer is provided. The method includes moving a dispensing nozzle to a predetermined position where the longitudinal axis of the dispensing nozzle aligns with the central axis of the semiconductor wafer. The method further includes dispensing a chemical liquid over the semiconductor wafer via the dispensing nozzle. The method also includes dispensing a photoresist over the semiconductor wafer that is coated with the chemical liquid via the dispensing nozzle. During the dispensing of the chemical liquid and the photoresist, the dispensing nozzle stays in the predetermined position.
    Type: Application
    Filed: January 31, 2018
    Publication date: March 28, 2019
    Inventors: Wu-Hsing HUANG, Chia-Hung KAO