Patents by Inventor Wu-Hsing HUANG

Wu-Hsing HUANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for matching parameters applied to display device, and circuit system
    Patent number: 11972720
    Abstract: A method for matching parameters applied to a display device and a circuit system that performs the method are provided. In the method, when a display device is activated, a circuit system connects to a panel module of the display device for retrieving parameters from a panel memory. The parameters are such as video display parameters, camera image parameters, speaker audio parameters, and microphone receiving parameters. After the parameters are applied to the circuit system, the circuit system operates the display device using the parameters. The data generated by the circuit system can be adjusted for matching new parameters. Afterwards, when the new parameters are applied to the circuit system, video and audio are outputted according to the matched parameters, and the camera and microphone in the panel module are also operated according to the matched parameters.
    Type: Grant
    Filed: May 4, 2022
    Date of Patent: April 30, 2024
    Assignee: REALTEK SEMICONDUCTOR CORP.
    Inventors: Yueh-Hsing Huang, Sen-Huang Tang, Wu-Chih Lin, Yen-Hsing Wu
  • Method and system for supplying chemical liquid in semiconductor fabrication
    Patent number: 11004679
    Abstract: A method for dispensing photoresist over a semiconductor wafer is provided. The method includes moving a dispensing nozzle to a predetermined position where the longitudinal axis of the dispensing nozzle aligns with the central axis of the semiconductor wafer. The method further includes dispensing a chemical liquid over the semiconductor wafer via the dispensing nozzle. The method also includes dispensing a photoresist over the semiconductor wafer that is coated with the chemical liquid via the dispensing nozzle. During the dispensing of the chemical liquid and the photoresist, the dispensing nozzle stays in the predetermined position.
    Type: Grant
    Filed: January 31, 2018
    Date of Patent: May 11, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Wu-Hsing Huang, Chia-Hung Kao
  • METHOD AND SYSTEM FOR SUPPLYING CHEMICAL LIQUID IN SEMICONDUCTOR FABRICATION
    Publication number: 20190096665
    Abstract: A method for dispensing photoresist over a semiconductor wafer is provided. The method includes moving a dispensing nozzle to a predetermined position where the longitudinal axis of the dispensing nozzle aligns with the central axis of the semiconductor wafer. The method further includes dispensing a chemical liquid over the semiconductor wafer via the dispensing nozzle. The method also includes dispensing a photoresist over the semiconductor wafer that is coated with the chemical liquid via the dispensing nozzle. During the dispensing of the chemical liquid and the photoresist, the dispensing nozzle stays in the predetermined position.
    Type: Application
    Filed: January 31, 2018
    Publication date: March 28, 2019
    Inventors: Wu-Hsing HUANG, Chia-Hung KAO
  • Male connector
    Patent number: D1027868
    Type: Grant
    Filed: December 23, 2020
    Date of Patent: May 21, 2024
    Assignee: REALTEK SEMICONDUCTOR CORP.
    Inventors: An-Ming Lee, Bo-Kai Huang, Wu-Chih Lin, Yueh-Hsing Huang