Abstract: An Ethernet Physical layer (PHY) device includes a PHY interface and PHY circuitry. The PHY interface is configured to connect to a physical link. The PHY circuitry is configured to generate layer-1 frames that carry data for transmission to a peer Ethernet PHY device, to insert among the layer-1 frames one or more management frames that are separate from the layer-1 frames and that are configured to control a General-Purpose Input-Output (GPIO) port associated with the peer Ethernet PHY device, to transmit the layer-1 frames and the inserted management frames, via the PHY interface, to the peer Ethernet PHY device over the physical link, for controlling one or more operations of the GPIO port associated with the peer Ethernet PHY device, and to receive, via the PHY interface, one or more verifications acknowledging that the one or more management frames were received successfully at the peer Ethernet PHY device.

Abstract: A testing system includes: a dividing circuit configured to receive a testing signal and provide a plurality of input signals according to the testing signal; and a plurality of integrated power-amplifiers coupled to the dividing circuit, each of the plurality of integrated power-amplifiers being configured to be tested by receiving a respective input signal of the plurality of input signals and generating a respective output signal for a predetermined testing time.

Abstract: A method for cleaning a reflective photomask, a method of manufacturing a semiconductor structure, and a system for forming a semiconductor structure are provided. The method for cleaning a reflective photomask includes placing a photomask in a first chamber, and performing a dry cleaning operation on the photomask in the first chamber, wherein the dry cleaning operation includes providing hydrogen radicals to the first chamber, generating hydrocarbon gases as a result of reactions of the hydrogen radicals, and removing the hydrocarbon gases from the first chamber.

Abstract: A method for cleaning a reflective photomask, a method of manufacturing a semiconductor structure, and a system for forming a semiconductor structure are provided. The method for cleaning a reflective photomask includes placing a photomask in a first chamber, and performing a dry cleaning operation on the photomask in the first chamber, wherein the dry cleaning operation includes providing hydrogen radicals to the first chamber, generating hydrocarbon gases as a result of reactions of the hydrogen radicals, and removing the hydrocarbon gases from the first chamber.

Abstract: A method of testing a photomask assembly includes placing the photomask assembly into a chamber, wherein the photomask assembly includes a pellicle attached to a first side of a photomask. The method further includes exposing the photomask assembly to a radiation source having a wavelength ranging from about 160 nm to 180 nm in the chamber to accelerate haze development, wherein the exposing of the photomask assembly includes illuminating an entirety of an area of the photomask covered by the pellicle throughout an entire illumination time and illuminating a frame adhesive attaching the pellicle to the photomask. The method further includes detecting haze of the photomask following exposing the photomask assembly to the radiation source. The method further includes predicting performance of the photomask assembly during a manufacturing process based on the detected haze of the photomask following exposing the photomask assembly to the radiation source.

Abstract: A chip matching system and a corresponding method are provided. The method defines a plurality of first electronic components in a first wafer as various grades of chips and defines a plurality of second electronic components in a second wafer as various grades of chips, and then grades of the first electronic components and the second electronic components are matched to generate target information, and finally the first and second electronic components are integrated in the same position according to the target information. Therefore, the highest-grade chips can be arranged in a multi-chip module to optimize the quality of the multi-chip module.

Abstract: A chip matching system and a corresponding method are provided. The method defines a plurality of first electronic components in a first wafer as various grades of chips and defines a plurality of second electronic components in a second wafer as various grades of chips, and then grades of the first electronic components and the second electronic components are matched to generate target information, and finally the first and second electronic components are integrated in the same position according to the target information. Therefore, the highest-grade chips can be arranged in a multi-chip module to optimize the quality of the multi-chip module.

Abstract: A method for cleaning a reflective photomask, a method of manufacturing a semiconductor structure, and a system for forming a semiconductor structure are provided. The method for cleaning a reflective photomask includes placing a photomask in a first chamber, and performing a dry cleaning operation on the photomask in the first chamber, wherein the dry cleaning operation includes providing hydrogen radicals to the first chamber, generating hydrocarbon gases as a result of reactions of the hydrogen radicals, and removing the hydrocarbon gases from the first chamber.

Abstract: A method for cleaning a reflective photomask is provided. The method includes: disposing the reflective photomask in a chamber; providing hydrogen radicals to the chamber; and exposing the reflective photomask to the hydrogen radicals. A method of manufacturing a semiconductor structure and system for forming a semiconductor structure are also provided.

Abstract: A chip matching system and a corresponding method are provided. The method defines a plurality of first electronic components in a first wafer as various grades of chips and defines a plurality of second electronic components in a second wafer as various grades of chips, and then grades of the first electronic components and the second electronic components are matched to generate target information, and finally the first and second electronic components are integrated in the same position according to the target information. Therefore, the highest-grade chips can be arranged in a multi-chip module to optimize the quality of the multi-chip module.

Abstract: Articles comprising: a molded substrate comprising one or more polycarbonate resins or blends of polycarbonate and polyester resins containing polydimethyl siloxanes modified with one or more of acrylate, hydroxyl or epoxy groups and disposed on the surface or a portion of the surface of the substrate is a cured silicone rubber; wherein the one or more polycarbonate resins or blends of polycarbonate and polyester resins contain the modified polydimethyl siloxanes in sufficient amount such that the peel strength is increased. Compositions comprising one or more polycarbonate resins or blends of polycarbonate and polyester resins containing polydimethyl siloxanes modified with one or more of acrylate, hydroxyl or epoxy groups in an amount of about 0.1 to less than 1.0 percent by weight. Methods for preparing the articles are disclosed.

Abstract: A device for roasting beans which is significantly easier to install and place in a bean-roasting machine includes a chassis, a bean roasting tube, and a driving member. The chassis defines an accommodating cavity and a receiving hole communicating with the accommodating cavity. The bean roasting tube includes a rotating member and a chamber. The rotating member is detachably connected to the chassis. The chamber includes a first end plate, a second end plate opposite to the first end plate, and a bearing piece fixedly connected between the first end plate and the second end plate. The second end plate faces the receiving hole and is rotatably connected to the rotating member. The driving member is fixed to the first end plate and movable to drive the chamber to rotate in the accommodating cavity.

Abstract: A junction line data generation method includes scanning a first junction component and a second junction component by using an image capturing device for generating three-dimensional first junction component modeling data of the first junction component and generating three-dimensional second junction component modeling data of the second junction component, simulating a first junction component structure by using the three-dimensional first junction component modeling data, simulating a second junction component structure by using the three-dimensional second junction component modeling data, and generating junction line data between the first junction component and the second junction component by optionally deforming the first junction component structure and/or the second junction component structure according to the first junction component structure and the second junction component structure.

Abstract: A method of testing a photomask assembly includes placing the photomask assembly into a chamber, wherein the photomask assembly includes a pellicle attached to a first side of a photomask. The method further includes exposing the photomask assembly to a radiation source having a wavelength ranging from about 160 nm to 180 nm in the chamber to accelerate haze development, wherein the exposing of the photomask assembly includes illuminating an entirety of an area of the photomask covered by the pellicle throughout an entire illumination time and illuminating a frame adhesive attaching the pellicle to the photomask. The method further includes detecting haze of the photomask following exposing the photomask assembly to the radiation source. The method further includes predicting performance of the photomask assembly during a manufacturing process based on the detected haze of the photomask following exposing the photomask assembly to the radiation source.

Abstract: A method of testing a photomask assembly is disclosed. The method includes placing a photomask assembly into a chamber. The photomask assembly includes a pellicle attached to a first side of a photomask. The method further includes exposing the photomask assembly to a radiation source in the chamber. The exposing of the photomask assembly includes illuminating an entirety of an area of the photomask covered by the pellicle throughout an entire illumination time.

Abstract: A method for cleaning a reflective photomask is provided. The method includes: disposing the reflective photomask in a chamber; providing hydrogen radicals to the chamber; and exposing the reflective photomask to the hydrogen radicals. A method of manufacturing a semiconductor structure and system for forming a semiconductor structure are also provided.

Abstract: A strong, durable, and more portable logistics box is capable of being assembled to form a three-dimensional box shape on rollers to store and transport items and being flattened for storage. The logistics box includes walls and locking devices including a first locking device and a second locking device. The walls include a bottom wall and a plurality of sidewalls. The sidewalls include a first sidewall, a last sidewall, and at least one middle sidewall rotatably connected between the first sidewall and the last sidewall. The first locking device is disposed between the first sidewall and the last sidewall and detachably connects the first sidewall to the last sidewall. The bottom wall is rotatably connected to one of the sidewalls. The second locking device is disposed between the bottom wall and another one of the sidewalls and detachably connects the bottom wall to the another one of the sidewalls.

Abstract: An adjustable partition structure includes a guiding member, two sets of support blocks, and an adjustable partition structure. The guiding member is fixed to a rear plate. The two sets of support blocks are respectively disposed on two side plates. Each set of support blocks includes a number of support blocks arranged in a longitudinal direction of the side plates. The adjustable partition structure includes a sliding member and an adjustable partition plate. The sliding member defines a sliding hole. The guiding member is received in the sliding hole. The sliding member is slidable relative to the rear plate along the guiding member. The adjustable partition plate and the sliding member are rotationally coupled together. Two side edges of the adjustable partition plate respectively form an abutting piece. The two abutting pieces are supported by the support blocks on a same plane to support the adjustable partition plate.

Abstract: A control device includes a housing and a button received within the housing. The housing defines a through hole and a latching slot. The button defines a pressing portion and a resilient arm. The pressing portion is slidably mounted within the through hole. One end of the resilient arm is coupled to the pressing portion, and a second end of the resilient arm is latched within the latching slot. When the pressing portion is pressed, the pressing portion slides to trigger a signal transmitting mechanism within the housing to emit a signal and causes the resilient arm to deform. When the pressing portion is released, the resilient arm is resiliently restored to cause the pressing portion to return to an initial position.