Patents by Inventor Wu-Hung Hsu

Wu-Hung Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Junction line data generation method and junction line data generation system capable of processing three-dimensional component modeling data automatically
    Patent number: 11138810
    Abstract: A junction line data generation method includes scanning a first junction component and a second junction component by using an image capturing device for generating three-dimensional first junction component modeling data of the first junction component and generating three-dimensional second junction component modeling data of the second junction component, simulating a first junction component structure by using the three-dimensional first junction component modeling data, simulating a second junction component structure by using the three-dimensional second junction component modeling data, and generating junction line data between the first junction component and the second junction component by optionally deforming the first junction component structure and/or the second junction component structure according to the first junction component structure and the second junction component structure.
    Type: Grant
    Filed: January 2, 2020
    Date of Patent: October 5, 2021
    Assignee: ABBOVI CO., LTD.
    Inventors: Chih-Yu Huang, Wu-Hung Hsu, Shang-Wen Wong
  • Junction Line Data Generation Method and Junction Line Data Generation System Capable of processing Three-dimensional Component Modeling Data Automatically
    Publication number: 20200234510
    Abstract: A junction line data generation method includes scanning a first junction component and a second junction component by using an image capturing device for generating three-dimensional first junction component modeling data of the first junction component and generating three-dimensional second junction component modeling data of the second junction component, simulating a first junction component structure by using the three-dimensional first junction component modeling data, simulating a second junction component structure by using the three-dimensional second junction component modeling data, and generating junction line data between the first junction component and the second junction component by optionally deforming the first junction component structure and/or the second junction component structure according to the first junction component structure and the second junction component structure.
    Type: Application
    Filed: January 2, 2020
    Publication date: July 23, 2020
    Inventors: Chih-Yu Huang, Wu-Hung Hsu, Shang-Wen Wong