Abstract: A laser beam shaping device includes a multi-zone structure lens and a focusing lens. The multi-zone structure lens includes a lens body and a refractive structure. The lens body has an incident plane and an emission plane, and one of the incident plane and the emission plane is furnished with the refractive structure. The light source passing through the refractive structure deviates and leaves the lens body via the emission plane. The light source passing through the lens body is divided into N sets of light beams. After the N sets of light beams penetrate through the focusing lens, N set of incident beams are formed to project the interface of the first material and the second material in an oblique inward manner with respect to the optical axis of the focusing lens. In additional, a laser processing system and a laser interlocking welding structure respectively are also provided.

Abstract: A laser beam shaping device includes a multi-zone structure lens and a focusing lens. The multi-zone structure lens includes a lens body and a refractive structure. The lens body has an incident plane and an emission plane, and one of the incident plane and the emission plane is furnished with the refractive structure. The light source passing through the refractive structure deviates and leaves the lens body via the emission plane. The light source passing through the lens body is divided into N sets of light beams. After the N sets of light beams penetrate through the focusing lens, N set of incident beams are formed to project the interface of the first material and the second material in an oblique inward manner with respect to the optical axis of the focusing lens. In additional, a laser processing system and a laser interlocking welding structure respectively are also provided.

Abstract: An apparatus for cutting a multilayer material includes a splitter module and a uniaxial crystal element. The splitter module, located in a transmission path of an incident light beam, is used for splitting the incident light beam into a first polarized light beam and a second polarized light beam. The uniaxial crystal element is disposed adjacent to the splitter module and on a transmission path of the first polarized light beam and the second polarized light beam. The first polarized light beam and the second polarized light beam pass through the uniaxial crystal element individually by having the first polarized light beam and the second polarized light in correspondence to different index of refractions, so that two focuses with different focal lengths can be obtained. In addition, a method for cutting a multilayer material method is also provided.

Abstract: The present invention provides a method for removing micro-debris generated in a laser machining process operated on machined object and device of the same. The machined object is placed on a movable machining platform within a machining range and machined at a particular machining location. By disposing an acoustic wave generator and a reflector part, or by disposing a plurality of acoustic wave generators, at least two standing waves extending across the machining range and two standing wave nodes are generated. The micro-debris generated from the laser machining process is moved away by the standing waves to concentrate at the standing wave nodes, and subsequently removed from the standing wave nodes.

Abstract: The present invention provides a method for removing micro-debris generated in a laser machining process operated on machined object and device of the same. The machined object is placed on a movable machining platform within a machining range and machined at a particular machining location. By disposing an acoustic wave generator and a reflector part, or by disposing a plurality of acoustic wave generators, at least two standing waves extending across the machining range and two standing wave nodes are generated. The micro-debris generated from the laser machining process is moved away by the standing waves to concentrate at the standing wave nodes, and subsequently removed from the standing wave nodes.

Abstract: The present invention provides a method for removing micro-debris generated in a laser machining process operated on machined object and device of the same. The machined object is placed on a movable machining platform within a machining range and machined at a particular machining location. By disposing an acoustic wave generator and a reflector part, or by disposing a plurality of acoustic wave generators, at least two standing waves extending across the machining range and two standing wave nodes are generated. The micro-debris generated from the laser machining process is moved away by the standing waves to concentrate at the standing wave nodes, and subsequently removed from the standing wave nodes.

Abstract: A hybrid card reader for IC cards/magnetic cards includes a casing consisting of an upper casing and a lower casing defining a card passage therebetween. A reduction gear train is mounted on the upper casing and driven by a motor mounted in the casing for driving a roller. Two parallel walls are mounted on the lower casing and include aligned slots defined therein. An idle wheel is mounted to face the roller to sandwich a card therebetween. A fixing member is swivelably mounted to the casing for supporting a magnetic head. A frame is slidably guided by the slots of the parallel walls for contacting with an IC on the card. The idle wheel contacts with the roller under the action of a spring wire when the card is not inserted into the card passage. When the card is inserted into the card passage, the card is sandwiched between the idle wheel and the roller and conveyed under rolling friction upon rotation of the roller.