Patents by Inventor Wu Sen Chiu

Wu Sen Chiu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated fan-out structure with openings in buffer layer
    Patent number: 9799581
    Abstract: A package includes a molding compound, a through-via penetrating through the molding compound, a device die molded in the molding compound, and a buffer layer on and contacting the molding compound. An opening is through the buffer layer to the through-via. The buffer layer has ripples in a plane parallel to an interface between the molding compound and the buffer layer and around a circumference of the opening. Other embodiments contemplate an additional package bonded to the package, and methods for forming the package.
    Type: Grant
    Filed: September 20, 2016
    Date of Patent: October 24, 2017
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wu Sen Chiu, Li-Hui Cheng, Po-Hao Tsai, Jing-Cheng Lin
  • Integrated Fan-Out Structure with Openings in Buffer Layer
    Publication number: 20170012024
    Abstract: A package includes a molding compound, a through-via penetrating through the molding compound, a device die molded in the molding compound, and a buffer layer on and contacting the molding compound. An opening is through the buffer layer to the through-via. The buffer layer has ripples in a plane parallel to an interface between the molding compound and the buffer layer and around a circumference of the opening. Other embodiments contemplate an additional package bonded to the package, and methods for forming the package.
    Type: Application
    Filed: September 20, 2016
    Publication date: January 12, 2017
    Inventors: Wu Sen Chiu, Li-Hui Cheng, Po-Hao Tsai, Jing-Cheng Lin
  • Integrated fan-out structure with openings in buffer layer
    Patent number: 9455211
    Abstract: A package includes a molding compound, a through-via penetrating through the molding compound, a device die molded in the molding compound, and a buffer layer on and contacting the molding compound. An opening is through the buffer layer to the through-via. The buffer layer has ripples in a plane parallel to an interface between the molding compound and the buffer layer and around a circumference of the opening. Other embodiments contemplate an additional package bonded to the package, and methods for forming the package.
    Type: Grant
    Filed: December 19, 2014
    Date of Patent: September 27, 2016
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wu Sen Chiu, Li-Hui Cheng, Po-Hao Tsai, Jing-Cheng Lin
  • Integrated Fan-Out Structure with Openings in Buffer Layer
    Publication number: 20150102502
    Abstract: A package includes a molding compound, a through-via penetrating through the molding compound, a device die molded in the molding compound, and a buffer layer on and contacting the molding compound. An opening is through the buffer layer to the through-via. The buffer layer has ripples in a plane parallel to an interface between the molding compound and the buffer layer and around a circumference of the opening. Other embodiments contemplate an additional package bonded to the package, and methods for forming the package.
    Type: Application
    Filed: December 19, 2014
    Publication date: April 16, 2015
    Inventors: Wu Sen Chiu, Li-Hui Cheng, Po-Hao Tsai, Jing-Cheng Lin