Abstract: The present invention provides a method for removing micro-debris generated in a laser machining process operated on machined object and device of the same. The machined object is placed on a movable machining platform within a machining range and machined at a particular machining location. By disposing an acoustic wave generator and a reflector part, or by disposing a plurality of acoustic wave generators, at least two standing waves extending across the machining range and two standing wave nodes are generated. The micro-debris generated from the laser machining process is moved away by the standing waves to concentrate at the standing wave nodes, and subsequently removed from the standing wave nodes.

Abstract: The present invention provides a method for removing micro-debris generated in a laser machining process operated on machined object and device of the same. The machined object is placed on a movable machining platform within a machining range and machined at a particular machining location. By disposing an acoustic wave generator and a reflector part, or by disposing a plurality of acoustic wave generators, at least two standing waves extending across the machining range and two standing wave nodes are generated. The micro-debris generated from the laser machining process is moved away by the standing waves to concentrate at the standing wave nodes, and subsequently removed from the standing wave nodes.

Abstract: A prestress-adjustable piezoelectric gripping device is provided, in which a prestressing device adjusts a prestressing force applied to a piezoelectric element of a piezoelectric unit on the basis of a feedback signal from a force-sensing unit, so as to adjust the friction between the piezoelectric unit and a gripping unit. By utilizing the deformation of the piezoelectric element to drive the gripping unit many times, the gripping velocity and gripping force of the gripping unit can be controlled, and the prestress-adjustable piezoelectric gripping device of the invention can achieve a long driving displacement while maintaining high precision.

Abstract: A prestress-adjustable piezoelectric gripping device is provided, in which a prestressing device adjusts a prestressing force applied to a piezoelectric element of a piezoelectric unit on the basis of a feedback signal from a force-sensing unit, so as to adjust the friction between the piezoelectric unit and a gripping unit. By utilizing the deformation of the piezoelectric element to drive the gripping unit many times, the gripping velocity and gripping force of the gripping unit can be controlled, and the prestress-adjustable piezoelectric gripping device of the invention can achieve a long driving displacement while maintaining high precision.

Abstract: The present invention provides a method for removing micro-debris generated in a laser machining process operated on machined object and device of the same. The machined object is placed on a movable machining platform within a machining range and machined at a particular machining location. By disposing an acoustic wave generator and a reflector part, or by disposing a plurality of acoustic wave generators, at least two standing waves extending across the machining range and two standing wave nodes are generated. The micro-debris generated from the laser machining process is moved away by the standing waves to concentrate at the standing wave nodes, and subsequently removed from the standing wave nodes.