Patents by Inventor Wu Yi Chou

Wu Yi Chou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HEAD OF A CHIP PICKER
    Publication number: 20220118631
    Abstract: A head of chip picker is disclosed. The head has a clipping seat and an elastic block. The clipping seat has a body and two arms. The arms are respectively and downwardly extended from two opposite sides of an inner top surface of the body, so a cavity with a wide-top and narrow-bottom shape is constituted among the inner top surface and the arms. The elastic block matches the cavity and is laterally inserted into the cavity. The elastic block is not deformed after inserting into the cavity and provides a flat bottom surface.
    Type: Application
    Filed: February 24, 2021
    Publication date: April 21, 2022
    Applicant: Powertech Technology Inc.
    Inventors: Wu-Yi CHOU, Kun-Chi HSU, Chin-Ta WU, Yung-Chin SHIH, Chin Cheng LIU, Jentung TSENG
  • DIE SUCKING MODULE
    Publication number: 20100000082
    Abstract: A die sucking module comprises a holder, a sucking head arranged below the holder and used to suck a die, and two pressing structures respectively arranged below the holder and at two sides of the sucking head. Each pressing structure further comprises a pressing head pressing against an adjacent die when the sucking head sucks a die; and an elastic element providing resilience to implement the function of the pressing head. The present invention can prevent from the double-die problem and promote the yield of the die-bond process.
    Type: Application
    Filed: August 20, 2008
    Publication date: January 7, 2010
    Inventor: Wu Yi Chou