Abstract: Disclosed is a new LED structure comprising a substrate, and a light emitting die entrained on the substrate. The substrate is made of the lower temperature co-fired ceramic or high temperature co-fired ceramic. The substrate is provided with a printed circuit which can be electrically in connection with an electric circuit board when it entrains the light emitting die. On the surface of the substrate where the light emitting die is to be set, is formed of a flared annular groove which has a light reflection pallet affixed to its lower surface. The surface of the light reflection pallet is coated with the silver glue, fluorescent powder, or other metallic substances. Under the annular groove and above the substrate is interposed an insulation bottom plate to entrain the light emitting die on and the die is connected to the positive and negative electrodes of the substrate with conductors. A number of pores are formed in the substrate and filled with heat dissipation substances.