Patents by Inventor Wu-Ying Su

Wu-Ying Su has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • COVER FILM WITH HIGH DIMENSIONAL STABILITY AND MANUFACTURING METHOD OF FLEXIBLE PRINTED CIRCUIT BOARD
    Publication number: 20160205776
    Abstract: A cover film with high dimensional stability includes an insulation film, a first adhesive layer, and a carrier. A first side of the first adhesive layer is connected to a first surface of the insulation film, and a second side of the first adhesive layer is configured to adhere to at least one metal conductor of a flexible printed circuit board. The carrier includes a supporting film and a second adhesive layer. A first side of the second adhesive layer is connected to the supporting film, and a second side of the second adhesive layer is adhered to a second surface of the insulation film, wherein bonding strength of the second adhesive film is smaller than bonding strength of the first adhesive film.
    Type: Application
    Filed: February 12, 2015
    Publication date: July 14, 2016
    Inventors: Hsiu-Chu Wu, Ching-Wen Yu, Wen-Chien Chen, Wu-Ying Su, Wei-Yuan Huang, Meng-Cheng Tsai, Chi-Sheng Hung