Patents by Inventor Wu-Yung Yang

Wu-Yung Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9914841
    Abstract: A colored matting powder includes particles containing a polyimide obtained by reacting diamine and dianhydride monomers at a substantially equal molar ratio, and a pigment incorporated with the polyimide, a portion of the pigment being located at an outer surface of the particles. Moreover, a colored polyimide film is also described as incorporating the colored matting powder, and can exhibit low gloss, low transparency and good insulation.
    Type: Grant
    Filed: January 27, 2014
    Date of Patent: March 13, 2018
    Assignee: Taimide Technology Incorporation
    Inventors: Chih-Wei Lin, Wu-Yung Yang
  • Publication number: 20140220335
    Abstract: A colored matting powder includes particles containing a polyimide obtained by reacting diamine and dianhydride monomers at a substantially equal molar ratio, and a pigment incorporated with the polyimide, a portion of the pigment being located at an outer surface of the particles. Moreover, a colored polyimide film is also described as incorporating the colored matting powder, and can exhibit low gloss, low transparency and good insulation.
    Type: Application
    Filed: January 27, 2014
    Publication date: August 7, 2014
    Applicant: TAIMIDE TECHNOLOGY INCORPORATION
    Inventors: Chih-Wei Lin, Wu-Yung Yang
  • Publication number: 20130279126
    Abstract: An aromatic polyimide film can be formed from a plurality of monomers comprising an aromatic dianhydride, and a first aromatic diamine selected from a group consisting of formulae (I) and (II): and wherein X and Y are respectively selected from the group consisting of oxygen, nitrogen and sulfur, and R and R? are respectively selected from the group consisting of NH2, wherein the aromatic polyimide film has an average linear coefficient of thermal expansion equal to or below about 5 ppm/° C. in a temperature range between about 50° C. and about 500° C.
    Type: Application
    Filed: November 6, 2012
    Publication date: October 24, 2013
    Applicant: Taimide Technology Incorporation
    Inventors: Chung-Yi Chen, Wu-Yung Yang, Chih-Wei Lin