Patents by Inventor Wu Zeng

Wu Zeng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Transistor, heat sink structure thereof and method for manufacturing same
    Patent number: 9520338
    Abstract: A transistor is provided, which includes: a semiconductor growth substrate and a semiconductor thermoelectric effect device, wherein the semiconductor thermoelectric effect device contains a semiconductor compound layer, a metal layer, a heat conducting layer, a thermocouple heat conducting device and a heat sink layer, the semiconductor compound layer is grown on the semiconductor growth substrate, the metal layer is grown on the semiconductor compound layer, the heat conducting layer is grown on the metal layer, the thermocouple heating conducting device is grown on the heat conducting layer, and the heat sink layer is grown on the other side surface of the thermocouple heat conducting device opposite to the heat conducting layer. The thermocouple heating conducting device may further contain power supply arms which are grown on the heat conducting layer and are electrically connected with the thermocouple heat conducting device.
    Type: Grant
    Filed: August 23, 2013
    Date of Patent: December 13, 2016
    Assignee: ZTE CORPORATION
    Inventors: Dapeng Wang, Zhiyong Zhao, Wu Zeng, Xuelu Mu, Baiqing Zong, Yijun Cui
  • TRANSISTOR, HEAT SINK STRUCTURE THEREOF AND METHOD FOR MANUFACTURING SAME
    Publication number: 20150348867
    Abstract: A transistor is provided, which includes: a semiconductor growth substrate and a semiconductor thermoelectric effect device, wherein the semiconductor thermoelectric effect device contains a semiconductor compound layer, a metal layer, a heat conducting layer, a thermocouple heat conducting device and a heat sink layer, the semiconductor compound layer is grown on the semiconductor growth substrate, the metal layer is grown on the semiconductor compound layer, the heat conducting layer is grown on the metal layer, the thermocouple heating conducting device is grown on the heat conducting layer, and the heat sink layer is grown on the other side surface of the thermocouple heat conducting device opposite to the heat conducting layer. The thermocouple heating conducting device may further contain power supply arms which are grown on the heat conducting layer and are electrically connected with the thermocouple heat conducting device.
    Type: Application
    Filed: August 23, 2013
    Publication date: December 3, 2015
    Inventors: Dapeng Wang, Zhiyong Zhao, Wu Zeng, Xuelu Mu, Baiqing Zong, Yijun Cui
  • Connector having bridge member for coupling ground terminals
    Patent number: 8764488
    Abstract: A connector (100) includes an insulative housing (1), a first and second ground terminals (211, 212), a first differential pair (213) and a bridge (3). The first differential pair is supported by the insulative housing (1) and positioned between the first and the second ground terminals. The bridge couples the first and the second ground terminals and disposed at an inner side of the insulative housing.
    Type: Grant
    Filed: January 12, 2012
    Date of Patent: July 1, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Tie-Wu Zeng
  • CONNECTOR HAVING BRIDGE MEMBER FOR COUPLING GROUND TERMINALS
    Publication number: 20120184145
    Abstract: A connector (100) includes an insulative housing (1), a first and second ground terminals (211, 212), a first differential pair (213) and a bridge (3). The first differential pair is supported by the insulative housing (1) and positioned between the first and the second ground terminals. The bridge couples the first and the second ground terminals and disposed at an inner side of the insulative housing.
    Type: Application
    Filed: January 12, 2012
    Publication date: July 19, 2012
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: TIE-WU ZENG