Patents by Inventor Wukun Dai

Wukun Dai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160085124
    Abstract: The present invention relates to a pixel structure and a manufacturing method thereof, a display panel and a display device. The pixel structure comprises a plurality of columns of pixels, a data line is provided between every two adjacent columns of pixels, each pixel comprises a pixel electrode and a thin film transistor comprising a gate, an active layer, a source and a drain, wherein, a gate protective layer is provided between the gates and the active layers, grooves, each of which is at least partially located between two adjacent columns of pixels, are provided in the gate protective layer, for opposite ends of the pixel electrodes of the two adjacent columns of pixels and the data line between the two adjacent columns of pixels, one is located in the groove, and the other is located on a part of the gate protective layer without the groove.
    Type: Application
    Filed: July 17, 2015
    Publication date: March 24, 2016
    Inventors: Lei CHEN, Zhilong PENG, Wukun DAI, Huanping LIU
  • Patent number: 9293340
    Abstract: A surface planarization method of thin film and a preparing method of an array substrate relate to a display field, and can solve the technical problem that the conventional dry etching severely damages the surface flatness of other film layers below the one being etched, thereby improving the display properties of the LCD. The preparing method of the array substrate comprises patterning a non-metallic layer (4) by a dry etching. And following the step of patterning a non-metallic layer (4) by the dry etching, the method further comprises performing surface planarization on a first film layer (3) to recover the first film layer (3) with a rough surface caused by the dry etching to be planar. The first film layer (3) is located below the non-metallic layer (4).
    Type: Grant
    Filed: June 5, 2013
    Date of Patent: March 22, 2016
    Assignees: BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Lei Chen, Ziqi Xia, Wukun Dai, Jiapeng Li, Xiuhong Jin, Fengguo Wang, Lei Zhang, Miao Qiu
  • Publication number: 20150378204
    Abstract: A display panel and a method for manufacturing the same and a display device are disclosed, the display panel comprises an array substrate (10) and a cell-assembled substrate (20) arranged oppositely to the array substrate (10), spacers spaced from each other are arranged between the array substrate (10) and the cell-assembled substrate (20), the spacers comprise a plurality of primary spacers (31); and M, in number, of the primary spacers (31) are provided per unit area in a peripheral region of the display panel, N, in number, of the primary spacers (31) are provided per unit area in a central region of the display panel, and M is greater than (>) N. The display panel can avoid the breakage of the spacers in the peripheral region of the display panel or the breakage of the orientation layer on the spacers.
    Type: Application
    Filed: July 3, 2014
    Publication date: December 31, 2015
    Applicants: BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Yuguang FAN, Wei WANG, Wukun DAI, Dengguo XIA
  • Publication number: 20150064927
    Abstract: A surface planarization method of thin film and a preparing method of an array substrate relate to a display field, and can solve the technical problem that the conventional dry etching severely damages the surface flatness of other film layers below the one being etched, thereby improving the display properties of the LCD. The preparing method of the array substrate comprises patterning a non-metallic layer (4) by a dry etching. And following the step of patterning a non-metallic layer (4) by the dry etching, the method further comprises performing surface planarization on a first film layer (3) to recover the first film layer (3) with a rough surface caused by the dry etching to be planar. The first film layer (3) is located below the non-metallic layer (4).
    Type: Application
    Filed: June 5, 2013
    Publication date: March 5, 2015
    Applicants: BEIJING BOE OPOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Lei Chen, Ziqi Xia, Wukun Dai, Jiapeng Li, Xiuhong Jin, Fengguo Wang, Lei Zhang, Miao Qiu