Patents by Inventor Wun-Yi Li

Wun-Yi Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090294099
    Abstract: A heat dispensing unit includes two heat dispensing plates between which the memory chip is clamped. Each heat dispensing plate has a plurality of bending plates which split from an inside of each of the heat dispensing plates and each bending plate has an insertion and a hole. When connecting the two heat dispensing plates, the first insertions on one of the two heat dispensing plates are engaged with the first holes of the other heat dispending plate. The heat dispensing plates have a flange on a top thereof so as to cover the gap between the two heat dispensing plates.
    Type: Application
    Filed: June 23, 2008
    Publication date: December 3, 2009
    Inventors: Wei-Hau Chen, Wun-Yi Li