Patents by Inventor Wurster KAI

Wurster KAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer edge protection
    Patent number: 9236240
    Abstract: A semiconductor device and a method for forming a device are presented. A wafer substrate having first and second regions is provided. The second region includes an inner region of the substrate while the first region includes an outer peripheral region from an edge of the substrate towards the inner region. A protection unit is provided above the substrate. The protection unit includes a region having a total width WT defined by outer and inner rings of the protection unit. The substrate is etched to form at least a trench in the second region of the substrate. The WT of the protection unit is sufficiently wide to protect the first region of the wafer substrate such that the first region is devoid of trench.
    Type: Grant
    Filed: February 28, 2013
    Date of Patent: January 12, 2016
    Assignee: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
    Inventors: Qiaoming Cai, Wurster Kai, Chunyan Xin, Frank Jakubowski
  • WAFER EDGE PROTECTION
    Publication number: 20140239454
    Abstract: A semiconductor device and a method for forming a device are presented. A wafer substrate having first and second regions is provided. The second region includes an inner region of the substrate while the first region includes an outer peripheral region from an edge of the substrate towards the inner region. A protection unit is provided above the substrate. The protection unit includes a region having a total width WT defined by outer and inner rings of the protection unit. The substrate is etched to form at least a trench in the second region of the substrate. The WT of the protection unit is sufficiently wide to protect the first region of the wafer substrate such that the first region is devoid of trench.
    Type: Application
    Filed: February 28, 2013
    Publication date: August 28, 2014
    Applicant: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
    Inventors: Qiaoming CAI, Wurster KAI, Chunyan XIN, Frank JAKUBOWSKI