Abstract: Advanced epoxy resin products are prepared by reacting a triglycidyl ether of a trihydric phenol such as the triglycidyl ether of 1,1,1-tri(hydroxyphenyl)methane with a dihydric phenol such as bisphenol A. These advanced epoxy resins are non-sintering solid resins useful in the preparation of electrical potting or molding compositions.

Abstract: Advanced epoxy resins having a low total aliphatic halide content are prepared by reacting an epoxy resin having an average of more than one 1,2-epoxide group per molecule with a material having an average of more than one phenolic hydroxyl group per molecule in the presence of a solvent having at least one aliphatic hydroxide group per molecule and a catalytic quantity of an alkali metal hydroxide. These low aliphatic halide-containing advanced epoxy resins are useful in formulations for preparing laminates, moldings, pottings and coatings for the electronics industry.

Abstract: The total halide content of epoxy resins is reduced by heating a resin containing halide dissolved in a solvent mixture containing at least one ketone, at least one aromatic hydrocarbon and optionally at least one compound containing at least one aliphatic hydroxyl group in the presence of an alkali metal hydroxide for a time sufficient to reduce the total halide content.