Abstract: Process for maintaining lead positions within a glass layer of a CQFP semiconductor device by using a magnet during high temperature assembly operations. During lead embed, a magnet (46) is magnetically attached to lead frame (44). Upon reflow of a glass layer (48), leads (50) sink into the glass layer to a height controlled by the height (H) of a protrusion (52) of the magnet. A similar magnet (62) can be used to maintain the lead positions during a high temperature operation used to cure a die attach material (60). Yet another magnet (70) can be used to maintain the positions of leads (50) during a lid seal operation. A common magnet design for use in all thermal operations can instead be used. Use of the magnets restrict movement of the leads within the glass layer when the glass is in a softened state.

Abstract: A process for positioning bond pads around a semiconductor die periphery on an octant basis, taking into account both manufacturing and design limitations. The process positions bond pad centers such that the spacing (pitch) increases towards the die corners. The pitch increase is iteratively calculated from an approximated wire angle. The process iteratively recalculates an octant's pad positions until optimum values are converged upon for the approximated wire angle of the cornermost bond pad and for the furthest allowable position for the cornermost bond pad. Once these optimum values are achieved, the resulting bond pad coordinates are stored in memory or a storage media in a format readable by a layout tool being used to design the die (or package). The resulting file is imported into the layout tool, which uses the stored information to physically position bond pads around the die periphery in the die layout.

Abstract: A wedge bond tool tip (20, 30, 50, 56) for bonding electronic interconnects to bonding pads of a semiconductor device enables fine-pitch non-orthogonal wire bonding. The tool tip (20, 30, 50, 56) has an overall width and a front face (12', 52) that has a reduced area which is narrower than the overall width. The reduction in the front face is accomplished through either chamfering or rounding of the corners to reduce the contact distance (42 and 44) between the wedge tool and a previously made adjacent bond. This design maintains the structural integrity needed to produce acceptable wedge bonds.