Patents by Inventor Xang Moua

Xang Moua has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7334325
    Abstract: The invention relates to an apparatus and method for improving coupling across plane discontinuities on circuit boards. A circuit board includes a discontinuity, e.g., a split, slot, or cutout, formed on a voltage reference plane. A conductive layer overlies the discontinuity. The conductive layer has a first portion connected to the underlying reference plane and a second portion spanning the discontinuity. The first portion is connected to the reference plane using a slot or vias. And the conductive layer has a third portion extending over the reference plane but remaining disconnected from it. The conductive layer might be graphite or carbon black.
    Type: Grant
    Filed: November 16, 2004
    Date of Patent: February 26, 2008
    Assignee: Intel Corporation
    Inventors: Weston Roth, Jayne L. Mershon, Xang Moua, Jason A. Mix
  • Patent number: 7282647
    Abstract: The invention relates to an apparatus and method for improving coupling across plane discontinuities on circuit boards. A circuit board includes a discontinuity, e.g., a split, slot, or cutout, formed on a voltage reference plane. A conductive layer overlies the discontinuity. The conductive layer has a first portion connected to the underlying reference plane and a second portion spanning the discontinuity. The first portion is connected to the reference plane using a slot or vias. And the conductive layer has a third portion extending over the reference plane but remaining disconnected from it. The conductive layer might be graphite or carbon black.
    Type: Grant
    Filed: December 23, 2002
    Date of Patent: October 16, 2007
    Assignee: Intel Corporation
    Inventors: Weston Roth, Jayne L. Mershon, Xang Moua, Jason A. Mix
  • Publication number: 20050082088
    Abstract: The invention relates to an apparatus and method for improving coupling across plane discontinuities on circuit boards. A circuit board includes a discontinuity, e.g., a split, slot, or cutout, formed on a voltage reference plane. A conductive layer overlies the discontinuity. The conductive layer has a first portion connected to the underlying reference plane and a second portion spanning the discontinuity. The first portion is connected to the reference plane using a slot or vias. And the conductive layer has a third portion extending over the reference plane but remaining disconnected from it. The conductive layer might be graphite or carbon black.
    Type: Application
    Filed: November 16, 2004
    Publication date: April 21, 2005
    Inventors: Weston Roth, Jayne Mershon, Xang Moua, Jason Mix
  • Publication number: 20040118597
    Abstract: The invention relates to an apparatus and method for improving coupling across plane discontinuities on circuit boards. A circuit board includes a discontinuity, e.g., a split, slot, or cutout, formed on a voltage reference plane. A conductive layer overlies the discontinuity. The conductive layer has a first portion connected to the underlying reference plane and a second portion spanning the discontinuity. The first portion is connected to the reference plane using a slot or vias. And the conductive layer has a third portion extending over the reference plane but remaining disconnected from it. The conductive layer might be graphite or carbon black.
    Type: Application
    Filed: December 23, 2002
    Publication date: June 24, 2004
    Applicant: Intel Corporation
    Inventors: Weston Roth, Jayne L. Mershon, Xang Moua, Jason A. Mix