Abstract: The transistor has source and drain diffusion regions between which a gate electrode is disposed. In order to increase the sheet resistance of the source and/or drain diffusion regions, a plurality of strip-shaped insulating zones are provided, which penetrate through the corresponding diffusion region. The zones are oriented perpendicularly to the gate electrode and the end a given spacing distance from the gate electrode.

Abstract: The transistor has source and drain diffusion regions between which a gate electrode is disposed. In order to increase the sheet resistance of the source and/or drain diffusion regions, a plurality of strip-shaped insulating zones are provided, which penetrate through the corresponding diffusion region. The zones are oriented perpendicularly to the gate electrode and the end a given spacing distance from the gate electrode.

Abstract: A semiconductor component includes a semiconductor body having a terminal pad, a semiconductor function element, and an electrically conductive connecting line connecting the terminal pad to the semiconductor function element. A protective element for protecting against electrostatic discharge is connected between the terminal pad and the semiconductor function element. A first supply line for a first supply potential is connected to the semiconductor function element. A second supply line for the first supply potential is connected to the protective element and is electrically conductively connected to the first supply line. A clamp element is connected to the connecting line and to the first supply line, for limiting a voltage applied to the clamp element to a clamp value.

Abstract: A circuit configuration protects the terminals of integrated circuits, in particular CMOS circuits. The circuit configuration includes bypass transistors connected between the terminals of the integrated circuit and respective supply potential terminals. The bypass transistors are thin-oxide transistors of the n-channel type and are connected such that their gate-to-source voltage is zero.

Abstract: Bipolar transistor in a protective element for integrated circuits. A bipolar transistor is used as a part of a protective element against electrical high voltages for integrated circuits in their integrated and dismantled condition, this bipolar transistor being insulated from the integrated circuit. A base terminal of the bipolar transistor is connected to a first voltage reference, a collector terminal is connected to a second voltage reference and an emitter terminal is connected to an input or output of the integrated circuit that is to be protected. As a result of the interconnection of the bipolar transistor and as a result of the insulation of the semiconductor substrate, substrate currents that occur during operation are kept as low as possible and the danger of a "latch-up" is thereby suppressed. The protective element may further contain an MOS field effect transistor or a resistive element.