Abstract: Improved passive optical coupling to photonic integrated circuit (PIC) chips is provided. An interposer unit (108) having one or more flexible optical waveguide members (112, 114, 116) is employed. The flexible optical waveguide members are coupled to the PIC chip (118) via their tips. The PIC chip includes alignment features to facilitate lateral, vertical and longitudinal passive alignment of the flexible optical waveguide members to on-chip optical waveguides of the PIC.

Abstract: Improved passive optical coupling to photonic integrated circuit (PIC) chips is provided. An interposer unit (108) having one or more flexible optical waveguide members (112, 114, 116) is employed. The flexible optical waveguide members are coupled to the PIC chip (118) via their tips. The PIC chip includes alignment features to facilitate lateral, vertical and longitudinal passive alignment of the flexible optical waveguide members to on-chip optical waveguides of the PIC.

Abstract: The present invention is directed to a semiconductor laser device comprising a first resonator section for resonating an optical resonator signal for providing an optical output signal at an output of said laser device, wherein said first resonator section is arranged for selectively resonating at a plurality of discrete output wavelengths, and wherein said laser device further comprises a second resonator section operatively connected to said first resonator section, said second resonator section being arranged for providing an optical feedback signal at a feedback wavelength to said first resonator section for locking said first resonator section into resonating at a selected output wavelength of said discrete output wavelengths, which selected output wavelength corresponds to said feedback wavelength for providing said optical output signal.