Patents by Inventor Xavier Blas Morales

Xavier Blas Morales has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11646514
    Abstract: A surface mount technology (SMT) terminal header is described for providing an electrical connection to a first printed circuit board (PCB). The SMT terminal header includes multiple first electrically conductive connector elements each having a base configured for surface mount attachment to the first PCB, and an insulative housing having multiple cells and a fixation member configured to attach the housing to the first PCB. Each of the multiple cells is configured to at least partially house one of the multiple first electrically conductive connector elements. Each of the first electrically conductive connector elements includes a position assurance member configured to attach the first electrically conductive connector element to at least one of the multiple cells of the insulative housing.
    Type: Grant
    Filed: August 10, 2020
    Date of Patent: May 9, 2023
    Assignee: LEAR CORPORATION
    Inventors: Jordi Claramunt Blanco, Xavier Blas Morales, Joan Ignasi Ferran Palau, Adil Khan
  • Patent number: 11374366
    Abstract: A system is described for providing an electrical ground connection for a circuit assembly. The system may include a housing for the circuit assembly, the housing having an electrically conductive fixation member configured for attachment to an electrically conductive element outside the housing. The system may also include an electrically conductive feature configured for attachment to the circuit assembly, the electrically conductive feature comprising a flexible contact terminal configured to contact the electrically conductive fixation member inside the housing. Attachment of the electrically conductive fixation member to the electrically conductive element outside the housing enables an electrical ground connection for the circuit assembly via the electrically conductive feature comprising the flexible contact terminal.
    Type: Grant
    Filed: June 19, 2020
    Date of Patent: June 28, 2022
    Assignee: LEAR CORPORATION
    Inventors: Joan Balana Avila, Alberto Aragones Carrete, Joan Ignasi Ferran Palau, Xavier Blas Morales, Oscar Cano Salomo
  • Patent number: 11277927
    Abstract: A system and method for mounting an electronics structure may include attaching a circuit assembly to a first support structure such that the circuit assembly is movable relative to the first support structure. It may also include at least partially covering the circuit assembly with a cover and moving the circuit assembly such that a predetermined portion of the circuit assembly is aligned with a predetermined portion of the cover. It may further include moving the cover such that the cover is attachable to a second support structure, and attaching the cover to the second support structure such that the predetermined portion of the circuit assembly remains aligned with the predetermined portion of the cover.
    Type: Grant
    Filed: November 5, 2019
    Date of Patent: March 15, 2022
    Assignee: Lear Corporation
    Inventors: Joan Balana Avila, Joan Ignasi Ferran Palau, Oscar Cano Salomo, Xavier Blas Morales, Jose Gabriel Fernandez
  • Publication number: 20220045444
    Abstract: A surface mount technology (SMT) terminal header is described for providing an electrical connection to a first printed circuit board (PCB). The SMT terminal header includes multiple first electrically conductive connector elements each having a base configured for surface mount attachment to the first PCB, and an insulative housing having multiple cells and a fixation member configured to attach the housing to the first PCB. Each of the multiple cells is configured to at least partially house one of the multiple first electrically conductive connector elements. Each of the first electrically conductive connector elements includes a position assurance member configured to attach the first electrically conductive connector element to at least one of the multiple cells of the insulative housing.
    Type: Application
    Filed: August 10, 2020
    Publication date: February 10, 2022
    Applicant: Lear Corporation
    Inventors: Jordi CLARAMUNT BLANCO, Xavier BLAS MORALES, Joan Ignasi FERRAN PALAU, Adil KHAN
  • Publication number: 20210399501
    Abstract: A system is described for providing an electrical ground connection for a circuit assembly. The system may include a housing for the circuit assembly, the housing having an electrically conductive fixation member configured for attachment to an electrically conductive element outside the housing. The system may also include an electrically conductive feature configured for attachment to the circuit assembly, the electrically conductive feature comprising a flexible contact terminal configured to contact the electrically conductive fixation member inside the housing. Attachment of the electrically conductive fixation member to the electrically conductive element outside the housing enables an electrical ground connection for the circuit assembly via the electrically conductive feature comprising the flexible contact terminal.
    Type: Application
    Filed: June 19, 2020
    Publication date: December 23, 2021
    Applicant: Lear Corporation
    Inventors: Joan BALANA AVILA, Alberto ARAGONES CARRETE, Joan Ignasi FERRAN PALAU, Xavier BLAS MORALES, Oscar CANO SALOMO
  • Publication number: 20210136937
    Abstract: A system and method for mounting an electronics structure may include attaching a circuit assembly to a first support structure such that the circuit assembly is movable relative to the first support structure. It may also include at least partially covering the circuit assembly with a cover and moving the circuit assembly such that a predetermined portion of the circuit assembly is aligned with a predetermined portion of the cover. It may further include moving the cover such that the cover is attachable to a second support structure, and attaching the cover to the second support structure such that the predetermined portion of the circuit assembly remains aligned with the predetermined portion of the cover.
    Type: Application
    Filed: November 5, 2019
    Publication date: May 6, 2021
    Inventors: Joan BALANA AVILA, Joan Ignasi FERRAN PALAU, Oscar CANO SALOMO, Xavier BLAS MORALES, Jose Gabriel FERNANDEZ
  • Patent number: 10750626
    Abstract: A connector assembly includes a connector, a circuit board, a housing. The connector may include a first portion, a second portion, and/or a third portion. The circuit board may include a first circuit board portion and/or a second circuit board portion. The connector may be configured to connect the first circuit board portion and/or the second circuit board portion to the housing. The first portion may be connected to the housing; the second portion may be connected to the first portion of the circuit board, and/or the third portion may be connected to the second portion of the circuit board. The first portion may include a first engagement portion, the second portion may include a second engagement portion, and/or the third portion may include a third engagement portion. The first engagement portion, the second engagement portion, and/or the third engagement portion may be disposed substantially perpendicular to each other.
    Type: Grant
    Filed: June 11, 2019
    Date of Patent: August 18, 2020
    Assignee: Lear Corporation
    Inventors: Xavier Blas Morales, Ramón Piñana López, Joan Vila, Joan Ignasi Ferran Palau, Angel Molinero Benitez, Jose Gabriel Fernández Bañares