Abstract: The present invention particularly relates to a method for physical vacuum deposition of a coating (R) comprising at least one material (M) on at least a portion of a front face (10) of a support (1), said at least one material (M) originating from an evaporation source or an atomisation source (2), wherein: —use is made of a support (1), at least a portion of the front face (10) of which is smooth, that is to say, does not have any roughness and/or reliefs and/or recesses; —said vacuum deposition is carried out while varying the thickness distribution of the material (M) on said front face (10), that is, while progressively varying the thickness deposited, from a central region (11) in the direction of at least one lateral region (12) contiguous to the central region (11), without modifying the position of the evaporation source or atomisation source (2) of the material particles (M).

Abstract: The present invention relates in particular to a security element (1) for a valuable document, which comprises an array (R) of at least two contiguous or adjacent lines (2, 2?, 2?), at least one of these lines (2) being raised and having two opposing and at least partially inclined sides (20, 21) that each originate along one of the longitudinal and opposing edges (200, 210) of the line (2), characterised by the fact that the two opposing inclined flanks (20, 21) meet at a single, uninterrupted, sinuous junction area (22), that extends in the longitudinal direction of the line (2), the sides (20, 21) having no discontinuities or interruptions at least in the longitudinal direction.

Abstract: The present invention particularly relates to an assembly (E) consisting of: a two-dimensional network of micro-optical devices such as microlenses; and a network of micro-images consisting, at most, of as many micro-images (ML) as micro-optical devices, each micro-image being subdivided into N image elements arranged in such a way as to reconstitute, for an observer and through the two-dimensional network of micro-optical devices, N images visble from N different points of view, i.e.

Abstract: The present invention particularly relates to a method for physical vacuum deposition of a coating (R) comprising at least one material (M) on at least a portion of a front face (10) of a support (1), said at least one material (M) originating from an evaporation source or an atomisation source (2), wherein:—use is made of a support (1), at least a portion of the front face (10) of which is smooth, that is to say, does not have any roughness and/or reliefs and/or recesses;—said vacuum deposition is carried out while varying the thickness distribution of the material (M) on said front face (10), that is, while progressively varying the thickness deposited, from a central region (11) in the direction of at least one lateral region (12) contiguous to the central region (11), without modifying the position of the evaporation source or atomisation source (2) of the material particles (M).

Abstract: The present invention relates in particular to a security element (1) for a valuable document, which comprises an array (R) of at least two contiguous or adjacent lines (2, 2?, 2?), at least one of these lines (2) being raised and having two opposing and at least partially inclined sides (20, 21) that each originate along one of the longitudinal and opposing edges (200, 210) of the line (2), characterised by the fact that the two opposing inclined flanks (20, 21) meet at a single, uninterrupted, sinuous junction area (22), that extends in the longitudinal direction of the line (2), the sides (20, 21) having no discontinuities or interruptions at least in the longitudinal direction.

Abstract: An assembly comprising a complex transparency device, i.e.

Abstract: An assembly comprising a complex transparency device, i.e.

Abstract: Method for mounting an electronic component, such as a silicon chip, on a support which consists in: providing an electronic component (40) having connection pads, whereof one predetermined pad (41A) is provided with a bump (42); providing a support having (30) to the predetermined pad via the bump; aligning the predetermined pad provided with the bump with the terminal; contacting the bump and the terminal and assembling them in specific temperature and pressure conditions. Prior to contacting and fixing the bump and the terminal, the surface of the terminal is covered with an insulating layer (32), the insulating layer being a material selected so as to be traversed by the bump in the temperature and pressure conditions.

Abstract: Method for mounting an electronic component, such as a silicon chip, on a support which consists in: providing an electronic component (40) having connection pads, whereof one predetermined pad (41A) is provided with a bump (42); providing a support having (30) to the predetermined pad via the bump; aligning the predetermined pad provided with the bump with the terminal; contacting the bump and the terminal and assembling them in specific temperature and pressure conditions. Prior to contacting and fixing the bump and the terminal, the surface of the terminal is covered with an insulating layer (32), the insulating layer being a material selected so as to be traversed by the bump in the temperature and pressure conditions.