Abstract: An electrical insulation system and method are disclosed which are based on poly(butylene terephthalate), wherein the poly(butylene terephthalate) contains a polymerized cyclic low molecular weight oligomeric poly(butylene terephthalate) resin. At least one filler material or a mixture of filler materials can be included. At least one hydrophobic compound or a mixture of hydrophobic compounds can also be included.

Abstract: A high temperature vulcanized silicone rubber is disclosed and includes a high temperature vulcanized silicone rubber as a silicone base and melamine cyanurate as a filler and at least one inorganic filler which is different from melamine cyanurate, and optionally further additives. A total filler content can be within a range of 40 parts (by weight) to 230 parts (by weight) per 100 parts (by weight) of silicone base; wherein (i) the melamine cyanurate is present within a range of 2 parts (by weight) to 40 parts (by weight) per 100 parts (by weight) of silicone base; and (ii) the at least one inorganic filler is an electrical insulator.

Abstract: A high temperature vulcanized silicone rubber is disclosed and includes a high temperature vulcanized silicone rubber as a silicone base and melamine cyanurate as a filler and at least one inorganic filler which is different from melamine cyanurate, and optionally further additives. A total filler content can be within a range of 40 parts (by weight) to 230 parts (by weight) per 100 parts (by weight) of silicone base; wherein (i) the melamine cyanurate is present within a range of 2 parts (by weight) to 40 parts (by weight) per 100 parts (by weight) of silicone base; and (ii) the at least one inorganic filler is an electrical insulator.

Abstract: Electrical insulation system, which optionally contains a filler material and/or further additives, wherein said electrical insulation system comprises poly(dicyclopentadiene) as the main component, and method of making said electrical insulation system.

Abstract: An electrical insulation system and method are disclosed which are based on poly(butylene terephthalate), wherein the poly(butylene terephthalate) contains a polymerized cyclic low molecular weight oligomeric poly(butylene terephthalate) resin. At least one filler material or a mixture of filler materials can be included. At least one hydrophobic compound or a mixture of hydrophobic compounds can also be included.

Abstract: The disclosure relates to a tape with nonlinear field control properties containing ZnO microvaristor particles. The doped ZnO particles are produced by crushing a sintered ZnO block, by desagglomeration or crushing of calcinated granulated particles, or by crushing of a calcined or sintered tape (tape casting). Embodiments, among other things, relate to: hollow ZnO microvaristor particles produced by granulation technique, having reduced average density and having diameters in a range well below 90 ?m; and compounding the Zno filler in binders that are used to impregnate tapes. Compared to nonlinear field control tapes with conventional embedded nonlinear filler particles, a stronger and more reliable nonlinear resistivity is achieved and the ZnO filler is simpler to produce and to compound in the binder. The resulting tapes are flexible, preferably self-adhesive and have a strong nonlinear electrical resistivity. The tapes are useful to protect high field-stress regions in electrical components.

Abstract: An epoxy resin formulation is disclosed. Such a formulation is suitable for the use as coil insulation material, wherein the formulation includes (a) a purified grade of at least one diglycidyl ether of a bisphenol compound or at least one cycloaliphatic diglycidyl ether compound or a mixture of such compounds, wherein the compounds have an epoxy equivalent weight not exceeding 10% of the minimum epoxy equivalent weight calculated for each compound; and (b) the formation optionally includes up to 50% by weight of a diglycidyl ether of a bisphenol compound or of a cycloaliphatic diglycidyl ether compound or a novolac epoxy or a mixture of such compounds, wherein the compounds have an epoxy equivalent weight exceeding 10% of the minimum epoxy equivalent weight calculated for each compound; and (c) a polymerization catalyst.