Abstract: The invention relates to plastic films and a silicone containing polymer blend composition that can be used in the production of the plastic films which is a polymer composition obtainable from, per 100 parts by weight of the composition, 99.99 to 90 parts by weight of a polyolefin polymer (P) and 0.01 to 10 parts by weight of a masterbatch (M).

Abstract: A method is described for debonding a carrier and device substrate using a high-intensity, pulsed, broadband light system that is suitable for wafer-level packaging applications. The carrier substrate is a transparent wafer with a light absorbing layer on one side of the wafer. This method utilizes the high intensity light to rapidly heat up the light absorbing layer to decompose or melt a bonding material layer that is adjacent to the light absorbing layer. After exposure to light, the carrier substrate can be lifted off the surface of the device wafer with little or no force.

Abstract: Examples relate to methods to print a garment and sublimation devices. A sublimation device comprises a heating system to heat an air flow and a holder to receive a garment. The holder comprises an outer surface to contact an inner side of the garment opposite to an outer side of the garment in which a print agent is to be deposited and an opening on the outer surface in fluid communication with the heated air flow.

Abstract: The invention relates to plastic films and a silicone containing polymer blend composition that can be used in the production of the plastic films which is a polymer composition obtainable from, per 100 parts by weight of the composition, 99.99 to 90 parts by weight of a polyolefin polymer (P) and 0.01 to 10 parts by weight of a masterbatch (M).