Abstract: A method for production of hollow bodies, in particular for radio-frequency resonators is shown and described. The object to provide a hollow bodies and a resonator, respectively, having improved electrical properties is achieved by a method comprising the following steps: Providing a substrate having a monocrystalline region, defining a cut area through the substrate, fitting markings on both sides of the cut area, producing two wafers by cutting along the cut area, wherein the wafers are completely removed from the monocrystalline region, forming the wafers into half-cells, wherein the half-cells have a joining area, joining together the half-cells to form a hollow body, wherein the joining areas bear on one another, and wherein the markings on the half-cells are oriented with respect to one another on both sides of the joining area as on both sides of the cut areas.

Abstract: A method for production of hollow bodies, in particular for radio-frequency resonators is shown and described. The object to provide a hollow bodies and a resonator, respectively, having improved electrical properties is achieved by a method comprising the following steps: Providing a substrate having a monocrystalline region, defining a cut area through the substrate, fitting markings on both sides of the cut area, producing two wafers by cutting along the cut area, wherein the wafers are completely removed from the monocrystalline region, forming the wafers into half-cells, wherein the half-cells have a joining area, joining together the half-cells to form a hollow body, wherein the joining areas bear on one another, and wherein the markings on the half-cells are oriented with respect to one another on both sides of the joining area as on both sides of the cut areas.