Patents by Inventor Xi Hong

Xi Hong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11951178
    Abstract: A nanoparticle delivery system designed for sustained delivery of microRNA-150 (miR-150) to FLT3-overexpressing acute myeloid leukemia (AML) cells, the delivery system comprising poly(amidoamine) (PAMAM) dendrimers complexed with miR-150, wherein at least one dendrimer is surface-functionalized with a ligand specific for FLT3 receptor, and methods for treating AML characterized by FLT3-overexpression are provided.
    Type: Grant
    Filed: July 14, 2021
    Date of Patent: April 9, 2024
    Assignees: University of Cincinnati, University of Chicago, The Board of Trustees of the University of Illinois
    Inventors: Jianjun Chen, Seungpyo Hong, Xi Jiang, Zejuan Li
  • Patent number: 9312243
    Abstract: A semiconductor package may include a first substrate, a second substrate facing the first substrate, a plurality of first electrical connections disposed between the first substrate and the second substrate, and a first material disposed between the first substrate and the second substrate. The plurality of first electrical connections may electrically couple the first substrate and the second substrate to each other. The first material may surround each of the plurality of first electrical connections, and a width of the first material proximal the first substrate may be smaller than a width of the first material proximal the second substrate.
    Type: Grant
    Filed: September 26, 2014
    Date of Patent: April 12, 2016
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Meng-Tse Chen, Yi-Da Tsai, Xi-Hong Chen, Tao-Hua Lee, Wei-Yu Chen, Ming-Da Cheng, Chung-Shi Liu
  • Publication number: 20150008594
    Abstract: A semiconductor package may include a first substrate, a second substrate facing the first substrate, a plurality of first electrical connections disposed between the first substrate and the second substrate, and a first material disposed between the first substrate and the second substrate. The plurality of first electrical connections may electrically couple the first substrate and the second substrate to each other. The first material may surround each of the plurality of first electrical connections, and a width of the first material proximal the first substrate may be smaller than a width of the first material proximal the second substrate.
    Type: Application
    Filed: September 26, 2014
    Publication date: January 8, 2015
    Inventors: Meng-Tse Chen, Yi-Da Tsai, Xi-Hong Chen, Tao-Hua Lee, Wei-Yu Chen, Ming-Da Cheng, Chung-Shi Liu
  • Patent number: 8889486
    Abstract: A package-on-package (“PoP”) structure and a method of forming are provided. The PoP structure may be formed by forming a first set of electrical connections on a first substrate. A first material may be applied to the first set of electrical connections. A second substrate may be provided having a second set of electrical connections formed thereon. The first set of electrical connections of the first substrate having the epoxy flux applied may be contacted to the second electrical connections of the second substrate. A reflow process may be performed to electrically connect the first substrate to the second substrate. The epoxy flux applied to the first electrical connections of the first substrate may prohibit electrical bridges or shorts from forming during the reflow process.
    Type: Grant
    Filed: September 5, 2012
    Date of Patent: November 18, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Meng-Tse Chen, Yi-Da Tsai, Xi-Hong Chen, Tao-Hua Lee, Wei-Yu Chen, Ming-Da Cheng, Chung-Shi Liu
  • Patent number: 8735633
    Abstract: A method comprising reacting glycerol with acetaldehyde or 1,1-diethoxyethane to produce 1,3-dihydroxyacetone (DHA), without using fermentation or direct oxidation of the glycerol is provided. DHA is useful in various products, including as a sunless tanning agent.
    Type: Grant
    Filed: July 14, 2011
    Date of Patent: May 27, 2014
    Assignee: Board of Trustees of Michigan State University
    Inventors: Dennis Miller, Xi Hong, Carl Lira, Omar McGiveron
  • Publication number: 20140061932
    Abstract: A package-on-package (“PoP”) structure and a method of forming are provided. The PoP structure may be formed by forming a first set of electrical connections on a first substrate. A first material may be applied to the first set of electrical connections. A second substrate may be provided having a second set of electrical connections formed thereon. The first set of electrical connections of the first substrate having the epoxy flux applied may be contacted to the second electrical connections of the second substrate. A reflow process may be performed to electrically connect the first substrate to the second substrate. The epoxy flux applied to the first electrical connections of the first substrate may prohibit electrical bridges or shorts from forming during the reflow process.
    Type: Application
    Filed: September 5, 2012
    Publication date: March 6, 2014
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Meng-Tse Chen, Yi-Da Tsai, Xi-Hong Chen, Tao-Hua Lee, Wei-Yu Chen, Ming-Da Cheng, Chung-Shi Liu
  • Publication number: 20120014889
    Abstract: A method comprising reacting glycerol with acetaldehyde or 1,1-diethoxyethane to produce 1,3-dihydroxyacetone (DHA), without using fermentation or direct oxidation of the glycerol is provided. DHA is useful in various products, including as a sunless tanning agent.
    Type: Application
    Filed: July 14, 2011
    Publication date: January 19, 2012
    Inventors: Dennis Miller, Xi Hong, Carl Lira, Omar McGiveron