Abstract: Presented herein are systems and methods for an end-to-end solution for object removal from a video using adaptive learning. In one or more embodiments, using a pre-trained image inpainting model, in-scene training data may be generated using optical-flow guided sampling. In one or more embodiments, the sampled patches are used to generate a training dataset, which is used to further train the image inpainting model until reaching a stop condition. The adaptively trained inpainting model may be used to generate a modified video in which the desired object or objects have been removed and the corresponding removed portion(s) have been filled (or inpainted) to preserve the integrity of the image.

Abstract: Some embodiments provide a method of identifying packet latency in a software defined datacenter (SDDC) that includes a network and multiple host computers executing multiple machines. At a first host computer, the method identifies and stores (i) multiple time values associated with several packet processing operations performed on a particular packet sent by a first machine executing on the first host computer, and (ii) a time value associated with packet transmission through the SDDC network from the first host computer to a second host computer that is a destination of the particular packet. The method provides the stored time values to a set of one or more controllers to process to identify multiple latencies experienced by multiple packets processed in the SDDC.

Abstract: The present disclosure describes methods and/or apparatus for gripping a plurality of types of circuit boards. For example, a method may include: gripping a first circuit board using a first sub-gripper of an integrated mechanical gripper, wherein the integrated mechanical gripper comprises a plurality of sub-grippers; placing the first circuit board into a transfer platform; gripping the first circuit board from the transfer platform using a second sub-gripper of the plurality of sub-grippers, flipping the first circuit board, and placing the flipped first circuit board into a splitter; splitting the first circuit board into at least one second circuit board with a different type or size from the first circuit board; and gripping the second circuit board from the splitter using a third sub-gripper of the plurality of sub-grippers.