Abstract: A combination thermal module includes a vapor chamber defining an airtight chamber filled with a working fluid and having at least one through hole formed thereon communicable with the airtight chamber; at least one annular wick structure provided in the airtight chamber corresponding to the through hole; and at least one heat pipe has an open end inserted into the airtight chamber to contact with a first wick structure on an inner lower surface of the vapor chamber and be axially supported on the annular wick structure. The annular wick structure includes communicable axial and radial passages, allowing vaporized working fluid to flow from the vapor chamber to the heat pipe quickly. With these arrangements, the thermal module has a shortened flow-back path between the vapor chamber and the heat pipe to avoid dry burning in the vapor chamber and upgrade the two-phase heat exchange efficiency of the vapor chamber.

Abstract: A combination heat dissipation structure includes a vapor chamber and at least one heat pipe. The vapor chamber defines an airtight chamber filled with a working fluid and provided with first and second wick structures. The vapor chamber further includes at least one through hole formed on its upper wall and communicable with the airtight chamber, and at least one annular element provided in the airtight chamber corresponding to the through hole to contact with the first and second wick structures. The heat pipe has an open end inserted into the airtight chamber to contact with the first wick structure, such that the heat pipe is axially supported and located by the annular element. With these arrangements, a flow-back path between the vapor chamber and the heat pipe is largely shortened to avoid dry burning in the vapor chamber and upgrade the two-phase heat exchange efficiency of the vapor chamber.

Abstract: A combination heat dissipation unit includes a vapor chamber defining an airtight chamber filled with a working fluid and at least one heat pipe having an open end. The vapor chamber is provided at an upper side with at least one through hole communicable with the airtight chamber and on a lower inner side with a first wick structure. At least one annular element is provided in the airtight chamber corresponding to the through hole. The open end of the heat pipe is correspondingly inserted into the through hole to enter the airtight chamber and contact with the annular element to be fixedly supported thereon. With these arrangements, the path and time for the working fluid to flow from the heat pipe back to the vapor chamber are largely shortened, dry burning in the vapor chamber is avoided, and two-phase heat exchange efficiency of the heat dissipation unit is upgraded.

Abstract: A vapor chamber having sealing structure, comprising a body and a capillary wick. The body has a first plate and a second plate. The first and second plates are attached to each other, which collectively define a sealed chamber therein and form a lip side. The lip side has an inlet channel and a stamping seal. The inlet channel is connected to the sealed chamber at one end and is connected to the stamping seal at the other end. The stamping seal is formed in a non-I shape. The capillary wick is selectively disposed within the sealed chamber of the body. Therefore, the air-tightness of the vapor chamber is increased by the stamping seal.

Abstract: A vapor chamber structure includes: a first plate body and a second plate body, which are mechanically processed and thinned, the first plate body having a first side, a second side and an opening, the second plate body having a third side and a fourth side, the first and second plate bodies being correspondingly mated with each other to define an airtight chamber, a working liquid being filled in the airtight chamber; a heat conduction block disposed at the opening, the heat conduction block having a first face and a second face; a first capillary structure layer disposed on the first side of the first plate body; and a second capillary structure layer formed on the second face of the heat conduction block. In case the first and second plate bodies are thinned to cause insufficient structural strength and planarity, the heat conduction block can reinforce the vapor chamber structure.