Abstract: A method for predicting outdoor three-dimensional space signal field strength by extended COST-231-Walfisch-Ikegami propagation model, comprising: establishing a three-dimensional scene model between a transmitting base station and a predicted region space; performing an on-site measurement according to a certain resolution in a prediction region and recording wireless signal strength information at a height of 1 m above the ground; acquiring a vertical cross section between the transmitting base station and a receiving point at a height of 1 m above the ground, and acquiring therefrom an average roof height, an average street width and an average between-building space; predicting a reception signal strength at a measurement point in a calculation formula of a COST-231-Walfishch-Ikegami propagation model; correcting the COST-231-Walfishch-Ikegami propagation model of the measurement point according to an error ? between measured data and a prediction result; acquiring a vertical cross section between the tra

Abstract: The present invention relates to a method for predicting indoor three-dimensional space signal field strength by an outdoor-to-indoor propagation model, which comprises the steps of: establishing a three-dimensional space scene model from a transmitting base station to a target building; predicting space field strength of an outer envelope of the target building according to an extended COST-231-Walfisch-Ikegami propagation model; generating, on the outer envelope of the target building, a series of out-door-to-indoor virtual rays in accordance with a certain resolution; simulating a propagation procedure of the virtual rays using a ray tracing propagation model algorithm, to predict three-dimensional space signal field strength in the target building.

Abstract: A method for predicting outdoor three-dimensional space signal field strength by extended COST-231-Walfisch-Ikegami propagation model, comprising: establishing a three-dimensional scene model between a transmitting base station and a predicted region space; performing an on-site measurement according to a certain resolution in a prediction region and recording wireless signal strength information at a height of 1 m above the ground; acquiring a vertical cross section between the transmitting base station and a receiving point at a height of 1 m above the ground, and acquiring therefrom an average roof height, an average street width and an average between-building space; predicting a reception signal strength at a measurement point in a calculation formula of a COST-231-Walfishch-Ikegami propagation model; correcting the COST-231-Walfishch-Ikegami propagation model of the measurement point according to an error ? between measured data and a prediction result; acquiring a vertical cross section between the tra

Abstract: The present invention relates to a method for predicting indoor three-dimensional space signal field strength by an outdoor-to-indoor propagation model, which comprises the steps of: establishing a three-dimensional space scene model from a transmitting base station to a target building; predicting space field strength of an outer envelope of the target building according to an extended COST-231-Walfisch-Ikegami propagation model; generating, on the outer envelope of the target building, a series of out-door-to-indoor virtual rays in accordance with a certain resolution; simulating a propagation procedure of the virtual rays using a ray tracing propagation model algorithm, to predict three-dimensional space signal field strength in the target building.

Abstract: A heat dissipation simulator of a component on a printed circuit board (PCB) includes a simulation board and a simulated heat source. The simulation board includes an iron layer and a plastic layer. The simulated heat source includes a simulation chip, a thermal, and a heat sink. The simulation chip, the thermal piece, and the heat sink are mounted on the simulation board in that order. The heat dissipation simulator replaces a sample of the PCB with the component for simulating working states of the component on the PCB.

Abstract: A heat dissipation simulator of a component on a printed circuit board (PCB) includes a simulation board and a simulated heat source. The simulation board includes an iron layer and a plastic layer. The simulated heat source includes a simulation chip, a thermal, and a heat sink. The simulation chip, the thermal piece, and the heat sink are mounted on the simulation board in that order. The heat dissipation simulator replaces a sample of the PCB with the component for simulating working states of the component on the PCB.

Abstract: A cable binding device for binding cables includes a connector from which the cables extend, a fixing member detachably mounted to the connector, and a binding member pivotably mounted to the fixing member to bind the cables.

Abstract: A plug tool for plugging or unplugging a connector includes a first operation member and a second operation member. The connector includes a plug, a resilient latching piece, and a cable. The first operation member includes a fastening shell receiving the plug and a sleeve extending out from the fastening shell receiving the cable of the connector. The second operation member is rotatably connected to the sleeve. The second operation member includes a pressing portion for pressing the latching piece of the connector toward the plug.

Abstract: A connector assembly includes a connector and an auxiliary device. The connector includes a connection portion, and a cable connected to a rear end of the connection portion. A latch extends up and back from a front end of the connection portion. The auxiliary device includes a fastening member fastened to the connector, and a resilient tab extending up and forward from the fastening member. A front end of the resilient tab is located above the latch.