Patents by Inventor Xia DENG

Xia DENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12132032
    Abstract: The disclosure relates to a micro component structure and a manufacturing method thereof, and a transfer method for a light-emitting diode (LED) chip. The micro component structure includes a substrate (300), multiple stacked adhesive layer structures spaced on a first surface (300a) of the substrate (300), and multiple LED chips (20) correspondingly disposed on the multiple stacked adhesive layer structures. Each of the multiple LED chips (20) has two extraction electrodes (21) at a surface facing toward the multiple stacked adhesive layer structures. Each of the multiple stacked adhesive layer structures includes a photolysis adhesive layer (31?) and a pyrolysis adhesive layer (32?) that are stacked. The photolysis adhesive layer (31?) is in contact with the first surface (300a). The pyrolysis adhesive layer (32?) is located between the two extraction electrodes (21) and has a thickness greater than a height of each of the two extraction electrodes (21).
    Type: Grant
    Filed: April 14, 2022
    Date of Patent: October 29, 2024
    Assignee: CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD.
    Inventors: Xia Deng, Chun-Lung Hsiao
  • Publication number: 20240063190
    Abstract: The present disclosure relates to an LED chip transfer method and a display panel. The LED chip transfer method includes: setting a pyrolytic adhesive film on a chip bearing surface of a first substrate, the pyrolytic adhesive film covering a plurality of LED chips on the chip bearing surface; bonding one surface of a second substrate to the pyrolytic adhesive film, and separating the LED chips from the first substrate; picking up a target LED chip to be transferred on the second substrate by using a transfer head, and heating the pyrolytic adhesive film until the target LED chip is separated from the pyrolytic adhesive film; and bonding the target LED chip on the transfer head to a drive substrate.
    Type: Application
    Filed: August 10, 2021
    Publication date: February 22, 2024
    Inventors: Xia DENG, Chun-lung HSIAO, Lijun CUI
  • Publication number: 20230317280
    Abstract: Disclosed is a finger kneading rating method based on intelligent model processing. The method includes the following steps: acquiring and sending finger kneading piezoelectric data meeting a preset pressure value; receiving the piezoelectric data meeting the preset pressure value, calculating and processing the piezoelectric data by using a data model, and outputting finger effective data; receiving the finger effective data, and inputting a preset training model for training to obtain a rating model; outputting the finger effective data and displaying the finger kneading evaluation result. Through the steps above, the effective times of finger kneading could be easily obtained, and the results of inaccurate counting and scoring in a short time could be avoided, thus greatly ensuring good accuracy and reliability of the test results of this project; meanwhile, the application provides powerful evidence for early identification, early treatment and treatment detection of Parkinson's disease.
    Type: Application
    Filed: April 1, 2022
    Publication date: October 5, 2023
    Applicant: Jiangxi Provincial People's Hospital
    Inventors: Renshi XU, Xia DENG
  • Publication number: 20230051769
    Abstract: The disclosure relates to a micro component structure and a manufacturing method thereof, and a transfer method for a light-emitting diode (LED) chip. The micro component structure includes a substrate (300), multiple stacked adhesive layer structures spaced on a first surface (300a) of the substrate (300), and multiple LED chips (20) correspondingly disposed on the multiple stacked adhesive layer structures. Each of the multiple LED chips (20) has two extraction electrodes (21) at a surface facing toward the multiple stacked adhesive layer structures. Each of the multiple stacked adhesive layer structures includes a photolysis adhesive layer (31?) and a pyrolysis adhesive layer (32?) that are stacked. The photolysis adhesive layer (31?) is in contact with the first surface (300a). The pyrolysis adhesive layer (32?) is located between the two extraction electrodes (21) and has a thickness greater than a height of each of the two extraction electrodes (21).
    Type: Application
    Filed: April 14, 2022
    Publication date: February 16, 2023
    Inventors: Xia DENG, CHUN-LUNG HSIAO
  • Publication number: 20230005878
    Abstract: A temporary chip assembly, a display panel, and manufacturing methods of the temporary chip assembly and the display panel are provided. In the display panel, welding points between a micro light-emitting chip and corresponding bonding pads on a display backboard are covered with pyrolytic adhesive to block water and oxygen, thereby slowing down or avoiding the oxidation of the welding points.
    Type: Application
    Filed: September 9, 2022
    Publication date: January 5, 2023
    Inventors: Feng ZHAI, Xia DENG, CHUN-LUNG HSIAO