Abstract: A chassis includes a base, a number of fans mounted in the base, and an air guiding member. The base includes a bottom wall and a sidewall perpendicularly connected to a side of the bottom wall. The fans are mounted on the bottom wall. The air guiding member includes a fixing portion slidably mounted to the sidewall and a guiding portion pivotably connected to the fixing portion. The guiding portion is pivotable to adjust the direction of airflow from the fans.

Abstract: In a method for adjusting a fan of an electronic device, a sensor of the electronic device detects an instant work environment temperature of an electronic component of the electronic device. The detected temperature is obtained from the sensor. The speed of the fan under the detected temperature and a speed of the fan to which it may be adjusted is computed using a predefined algorithm based on prestored values, obtained from experimentation. The fan is adjusted to achieve a heat dissipation mode and an energy-saving mode of the electronic device accordingly.

Abstract: A heat dissipation device includes a heat absorbing member, a number of fins mounted on the heat absorbing member, a first connecting pipe, and a second connecting pipe. A top surface of the heat absorbing member defines a serpentine slot. The slot includes an inlet hole and an outlet hole communicating with two opposite ends of the slot and extending through the heat absorbing member. The first connecting pipe is connected to the inlet hole of the heat absorbing member, and the second pipe is connected to the outlet hole of the heat absorbing member.

Abstract: An electronic device includes a chassis and a heat dissipation apparatus. The chassis includes a sidewall defining a latching hole and a rear wall defining an opening adjacent to the latching hole. The heat dissipation apparatus is detachably inserted in the chassis from the opening. The heat dissipation apparatus includes a casing defining a positioning slot aligning with the latching hole of the chassis, a liquid cooling assembly received in the casing, and a resilient latching member. A first end of the latching member is mounted in the casing. A latching block protrudes out from a second end of the latching member. The latching block extends through the positioning slot, to be latched in the latching hole of the chassis.

Abstract: A water tank includes a box, an air valve body, a valve core, a cap, and an elastic element. The box defines an accommodating space and a vent communicating with the accommodating space. The air valve body is extended out from the box and adjacent to the vent. The valve core is mounted to the valve body to airproof the vent, and comprises a first end inserted into the accommodating space through the vent and a second end opposite to the first end. The elastic element is arranged between the cap and the valve core. The valve core will open the vent to deform the elastic member and allow heated air in the accommodating space to leak out of the accommodating space through the vent, in response to an air pressure in the box is greater a reference air pressure.

Abstract: An electronic device includes a server unit, a storage apparatus, and a heat dissipation apparatus. The server unit includes a bottom plate defining a first air inlet. The heat dissipation apparatus includes an exhaust fan located above the bottom plate and an air adjusting member. The exhaust fan includes a second air inlet aligning with the first air inlet. The adjusting member is slidably located between the first air inlet and the second air inlet. The bottom plate and the storage apparatus cooperatively bound an airflow channel communicating with the first air inlet. The second air inlet is partitioned into a first air inlet communicating with the airflow channel and a second air inlet communicating with the server unit by the air adjusting member. The air adjusting member is operated to slide to change sizes of the first air inlet and the second air inlet.

Abstract: A heat dissipation system includes a chassis, a number of heat absorbing boxes, a number of pipes, a first water tank and a second water tank received in the chassis, a number of fins sandwiched between the first water tank and the second water tank, a number of fans aligning with the fins, and a water pump connected between the first water tank and the second water tank. Each heat absorbing box includes a water inlet and a water outlet, and heat from electrical components is gathered by the boxes, transferred to the water tanks, and the fans blow air through the fins to dissipate the gathered heat.

Abstract: An electronic device includes a server unit, a storage apparatus, and a heat dissipation apparatus. The server unit includes a bottom plate defining a first air inlet. The heat dissipation apparatus includes an exhaust fan located above the bottom plate and an air adjusting member. The exhaust fan includes a second air inlet aligning with the first air inlet. The adjusting member is slidably located between the first air inlet and the second air inlet. The bottom plate and the storage apparatus cooperatively bound an airflow channel communicating with the first air inlet. The second air inlet is partitioned into a first air inlet communicating with the airflow channel and a second air inlet communicating with the server unit by the air adjusting member. The air adjusting member is operated to slide to change sizes of the first air inlet and the second air inlet.

Abstract: A computer enclosure includes a sidewall and a fan mounting apparatus. The sidewall defines a ventilation area and four slide slots around the ventilation area. The fan mounting apparatus includes two opposite first position member, and two opposite second position members alternately arranged with the first position members. The first and second position members are slidably connected end to end and cooperatively define a ring. The first and second position plates are moved toward or away from each other. The first and second position members are slidably and respectively connected to the slide slots, to decrease or increase a diameter of the ring for selectively mounting different sized fans.

Abstract: A fan assembly includes a fan and a number of airflow guiding members. The fan includes an end board on which a number of airflow guides may be pivoted out to a horizontal position by airflow pressure but which fall back to a vertical position when the fan is not working, to effectively seal the vent when an airflow is not present.

Abstract: In a method for adjusting a fan of an electronic device, a sensor of the electronic device detects an instant work environment temperature of an electronic component of the electronic device. The detected temperature is obtained from the sensor. The speed of the fan under the detected temperature and a speed of the fan to which it may be adjusted is computed using a predefined algorithm based on prestored values, obtained from experimentation. The fan is adjusted to achieve a heat dissipation mode and an energy-saving mode of the electronic device accordingly.

Abstract: A heat dissipation system includes a chassis, a number of heat absorbing boxes, a number of pipes, a first water tank and a second water tank received in the chassis, a number of fins sandwiched between the first water tank and the second water tank, a number of fans aligning with the fins, and a water pump connected between the first water tank and the second water tank. Each heat absorbing box includes a water inlet and a water outlet, and heat from electrical components is gathered by the boxes, transferred to the water tanks, and the fans blow air through the fins to dissipate the gathered heat.

Abstract: A heat dissipation device includes a heat absorbing member, a number of fins mounted on the heat absorbing member, a first connecting pipe, and a second connecting pipe. A top surface of the heat absorbing member defines a serpentine slot. The slot includes an inlet hole and an outlet hole communicating with two opposite ends of the slot and extending through the heat absorbing member. The first connecting pipe is connected to the inlet hole of the heat absorbing member, and the second pipe is connected to the outlet hole of the heat absorbing member.

Abstract: An electronic device includes a chassis and a heat dissipation apparatus. The chassis includes a sidewall defining a latching hole and a rear wall defining an opening adjacent to the latching hole. The heat dissipation apparatus is detachably inserted in the chassis from the opening. The heat dissipation apparatus includes a casing defining a positioning slot aligning with the latching hole of the chassis, a liquid cooling assembly received in the casing, and a resilient latching member. A first end of the latching member is mounted in the casing. A latching block protrudes out from a second end of the latching member. The latching block extends through the positioning slot, to be latched in the latching hole of the chassis.

Abstract: A chassis includes a base, a number of fans mounted in the base, and an air guiding member. The base includes a bottom wall and a sidewall perpendicularly connected to a side of the bottom wall. The fans are mounted on the bottom wall. The air guiding member includes a fixing portion slidably mounted to the sidewall and a guiding portion pivotably connected to the fixing portion. The guiding portion is pivotable to adjust the direction of airflow from the fans.

Abstract: A fan includes a main body, an end wall connected an end of the main body, and a power connector. The main body defines a receiving space extending through the end wall in a bottom. The receiving space includes two sidewalls defining two slide slots. The power connector includes a first end surface forming a pole, and a second end surface forming a connecting portion. Opposite ends of the pole are engaged in the slide slots. When the power connector is received in the receiving space, the connecting portion is perpendicular to the end wall and faces downward. When the power connector is moved out of the receiving space, the power connector can be pivoted to be fixed to the end wall, to allow the connecting portion to be parallel to and face away from the end wall.

Abstract: A server cabinet includes a cabinet body and a heat dissipation apparatus attached to one side of the cabinet body. The heat dissipation apparatus includes a thermal conductive film, a heat sink, and a side cover fixed to the cabinet body. The side cover defines an opening for receiving the heat sink. The thermal conductive film is adhered to the side of the cabinet body. The heat sink contacts with the thermal conductive film.

Abstract: A mounting apparatus includes a case. The case includes a first bracket and a second bracket. The first bracket defines a space. The second bracket is configured for securing a fan and is connected with the first bracket. The second bracket has a volume equal to or less than the volume of the first bracket space.

Abstract: A memory slot defines a slot for receiving a memory card. Two resilient fixing members and a number of pins extend down from a bottom of the memory slot.

Abstract: A cover of a chassis includes a board defining an opening, and a vent plate slidably mounted to the board and covering the opening. The vent plate defines a number of vents. The vent plate can be slid to adjust the vents to align with or stagger from the opening.