Abstract: A motherboard testing apparatus for testing a motherboard by subjecting it to sequential power-on and power-off modes includes a control module, a switch module and a display module. The control module stores power-on and power-off number of times and outputs control signals accordingly. The switch module provides a first voltage to the motherboard according to the control signals. The switch module includes a photocoupler and a delay. The photocoupler includes an LED and a phototransistor. The delay includes a winding element and a switch element. The display module displays the time periods and the number of times the motherboard abnormally power-on and power-off. The LED receives the control signals. The phototransistor turns on when the LED emits light. The winding element is powered up and closes the switch element. The switch element outputs the first voltage.

Abstract: A fan speed testing system includes a voltage regulating module, a rotational frequency collecting module, and a rotational frequency converting module. The voltage regulating module receives an AC voltage signal and converts the AC voltage signal to a variable first DC voltage signal to adjust a rotational speed of a fan. The rotational frequency collecting module detects the rotational speed of the fan and outputs rotational frequency signals. The rotational frequency converting module receives the rotational frequency signals and determines the rotational speed of the fan according to numbers and period of time level voltage switching in the rotational frequency signals.

Abstract: A temperature control system includes a temperature sensing module, a temperature control module, a pulse width modulation control module, a heating module, a heat dissipating module, and a switch module. The temperature sensing module is configured to obtain a current ambient temperature in a test box. The temperature control module is configured to output a control signal according to a difference between the current ambient temperature and a reference temperature. The pulse width modulation control module is configured to output a pulse width modulation signal according to the control signal. The switch module is configured to instruct the heating module or the heat dissipating module according to the pulse width modulation signal to keep the current ambient temperature generally equal to the reference temperature in the test box.

Abstract: A solder apparatus includes a platform, an operating mechanism, a solder member, a heater, and a control box module. The control box module includes a temperature controller and a temperature sensor. The temperature controller defines a predetermined temperature. The temperature sensor is capable of measuring the temperature of the solder member. The temperature controller has the heater heat the solder member when the measured temperature of the solder member is lower than or equal to the predetermined temperature, and has the heater stop heating the solder member, when the measured temperature of the solder member is higher than the predetermined temperature.

Abstract: A fan speed testing system for testing a testing fan includes a testing fan, a collecting module, a processing module, a converting module; and a displaying module. A label is attached to the testing fan and capable of rotating with the testing fan. The collecting module is configured to collect light reflected off of the label as the fan rotates in order to produce a pulse signal. The processing module is configured to adjust the pulse signal to be a standard square wave. The converting module is configured to obtain a fan speed data of the testing fan according to conversion times between high levels and low levels of the standard square wave. The displaying module is configured to display the fan speed data.

Abstract: A test system includes a testing power supply unit which includes a rectifier and filter circuit and a voltage output circuit, a dropping voltage circuit which includes a primary coil and a secondary coil, a PWM regulator, and a control circuit. The rectifier and filter circuit receives an AC voltage and converts the AC voltage into a square wave signal. The primary coil is connected to the rectifier and filter circuit and receives the square wave signal. The secondary coil is connected to the voltage output circuit. The PWM regulator is connected to the primary coil. The PWM regulator generates a pulse signal to turn on and turn off the primary coil periodically. The control circuit is connected to the PWM regulator. The control circuit controls a duty cycle of the pulse signal to adjust time of the primary coil being on in a cycle.

Abstract: A motherboard testing apparatus for testing a motherboard by subjecting it to sequential power-on and power-off modes includes a control module, a switch module and a display module. The control module stores power-on and power-off number of times and outputs control signals accordingly. The switch module provides a first voltage to the motherboard according to the control signals. The switch module includes a photocoupler and a delay. The photocoupler includes an LED and a phototransistor. The delay includes a winding element and a switch element. The display module displays the time periods and the number of times the motherboard abnormally power-on and power-off. The LED receives the control signals. The phototransistor turns on when the LED emits light. The winding element is powered up and closes the switch element. The switch element outputs the first voltage.

Abstract: A solder apparatus includes a platform, an operating mechanism, a solder member, a heater, and a control box module. The control box module includes a temperature controller and a temperature sensor. The temperature controller defines a predetermined temperature. The temperature sensor is capable of measuring the temperature of the solder member. The temperature controller has the heater heat the solder member when the measured temperature of the solder member is lower than or equal to the predetermined temperature, and has the heater stop heating the solder member, when the measured temperature of the solder member is higher than the predetermined temperature.

Abstract: A fan speed testing system includes a voltage regulating module, a rotational frequency collecting module, and a rotational frequency converting module. The voltage regulating module receives an AC voltage signal and converts the AC voltage signal to a variable first DC voltage signal to adjust a rotational speed of a fan. The rotational frequency collecting module detects the rotational speed of the fan and outputs rotational frequency signals. The rotational frequency converting module receives the rotational frequency signals and determines the rotational speed of the fan according to numbers and period of time level voltage switching in the rotational frequency signals.

Abstract: A fan speed testing system for testing a testing fan includes a testing fan, a collecting module, a processing module, a converting module; and a displaying module. A label is attached to the testing fan and capable of rotating with the testing fan. The collecting module is configured to collect light reflected off of the label as the fan rotates in order to produce a pulse signal. The processing module is configured to adjust the pulse signal to be a standard square wave. The converting module is configured to obtain a fan speed data of the testing fan according to conversion times between high levels and low levels of the standard square wave. The displaying module is configured to display the fan speed data.

Abstract: A temperature control system includes a temperature sensing module, a temperature control module, a pulse width modulation control module, a heating module, a heat dissipating module, and a switch module. The temperature sensing module is configured to obtain a current ambient temperature in a test box. The temperature control module is configured to output a control signal according to a difference between the current ambient temperature and a reference temperature. The pulse width modulation control module is configured to output a pulse width modulation signal according to the control signal. The switch module is configured to instruct the heating module or the heat dissipating module according to the pulse width modulation signal to keep the current ambient temperature generally equal to the reference temperature in the test box.