Abstract: A making device of ice balls comprises a refrigeration chamber unit; the refrigeration chamber unit comprises a lower half ball mold body, an upper half ball mold body and a water circulation unit; in addition, a cover plate is arranged above the refrigeration chamber unit, and a water injection hole is arranged on the cover plate; in addition, a plurality of low-temperature condensing tubes are arranged in the lower half ball mold body; in addition, the refrigeration chamber unit further comprises a thermo electric cooler, and a cold end face of the thermo electric cooler is attached to a bottom surface of the lower half ball mold body; the upper half ball mold body is arranged above the lower half ball mold body, a plurality of convection circulation holes are distributed on the upper half ball mold body, and a water inlet hole is arranged in the center of the upper half ball mold body; and the water circulation unit is arranged on the cover plate and comprises a pump, and the pump is respectively connected

Abstract: A Fourier ptychography system includes a polarization-sensitive camera positioned for capturing a sequence of polarized images of a sample, an objective lens positioned in a light path between the polarization-sensitive camera and the sample, an array of light sources for directing light to the sample and a generator polarizer positioned between the array of light sources and the sample to polarize light directed to the sample from the array of light sources. A method of creating a tomographic Fourier ptychography image includes receiving, from a polarization-sensitive camera, a sequence of polarized images of a sample, stitching each image of the sequence of images together using a non-linear Fourier transform function to create a composite image, and outputting the composite image as the tomographic Fourier ptychography image. Each polarized image of the sequence of polarized images overlaps another polarized image of the sequence of polarized images.

Abstract: A making device of ice balls comprises a refrigeration chamber unit; the refrigeration chamber unit comprises a lower half ball mold body, an upper half ball mold body and a water circulation unit; in addition, a cover plate is arranged above the refrigeration chamber unit, and a water injection hole is arranged on the cover plate; in addition, a plurality of low-temperature condensing tubes are arranged in the lower half ball mold body; in addition, the refrigeration chamber unit further comprises a thermo electric cooler, and a cold end face of the thermo electric cooler is attached to a bottom surface of the lower half ball mold body; the upper half ball mold body is arranged above the lower half ball mold body, a plurality of convection circulation holes are distributed on the upper half ball mold body, and a water inlet hole is arranged in the center of the upper half ball mold body; and the water circulation unit is arranged on the cover plate and comprises a pump, and the pump is respectively connected

Abstract: A processing apparatus can include a memory device having a user space for executing user applications. The processing apparatus can further include infrastructure communication circuitry that can receive a request from a user application executing in the user space. The infrastructure communication circuitry can perform a service mesh operation, in response to the request, without a sidecar proxy. Other systems and methods are described.

Abstract: Provided is a method for feature extraction of a remote sensing image based on tensor collaborative graph discriminant analysis, including: taking each of pixels as a center for intercepting a three-dimensional tensor data block; dividing experimental data into a training set and a test set in proportion; computing a Euclidean distance between a current training pixel and each class of training data; configuring a L2 norm collaborative representation model with a weight constraint; acquiring a projection matrix of each dimension of each of the three-dimensional tensor data block; and utilizing a low-dimensional projection matrix to obtain a training set and a test set, expanding the training set and the test set into a form of column vectors according to a feature dimension, inputting extracted low-dimensional features into a support vector machine classifier for classification, to determine a class of the test set, and evaluating, by a classification effect, performance of feature extraction.

Abstract: A microscopy system includes a lens, an image sensor, a planar array of light sources, and a first and second polarizing filter. The lens is disposed between the array and the image sensor. The image sensor has a field of view and is positioned to capture an image of a sample in a target area. Each light source provides light from a different direction to the target area. The first polarizing filter and the second polarizing filter are each positioned at a rotation angle. A method of microscopy imaging includes illuminating a sample positioned in a target area of a lens with a light source from an array of light sources, acquiring a set of images by an image sensor of the illuminated sample, and performing a reconstruction algorithm on the set of images to generate a composite high-resolution image over the field of view of the image sensor.

Abstract: A processing method for reducing power consumption and a mobile terminal are provided. The method includes: controlling a sensor coprocessor to enter a dormant state, in a case that the mobile terminal is in a screen-off state; receiving a trigger instruction transmitted by a touch screen coprocessor, wherein the trigger instruction is transmitted when data collected by a sensor connected to the touch screen coprocessor meets a predetermined trigger condition; and controlling the mobile terminal to perform a function corresponding to the trigger s action.

Abstract: A processing method for reducing power consumption and a mobile terminal are provided. The method includes: controlling a sensor coprocessor to enter a dormant state, in a case that the mobile terminal is in a screen-off state; receiving a trigger instruction transmitted by a touch screen coprocessor, wherein the trigger instruction is transmitted when data collected by a sensor connected to the touch screen coprocessor meets a predetermined trigger condition; and controlling the mobile terminal to perform a function corresponding to the trigger s action.

Abstract: The present invention relates to an aqueous electrochemical energy storage apparatus which comprises an electrochemical energy storage device comprising an electrochemical energy storage device with an inlet and outlet and respectively connected to an external fluid circulation apparatus that facilitates the fluid circulation entering and exiting the said energy storage device, to regulate the physical, chemical, and electrochemical conditions within the said energy storage device. The present invention also relates to a method for optimizing or restoring the electrochemical performance of an energy storage device, enhancing various performance and greatly extending the service life thereof by upgrading the electrolyte inside and outside the energy storage device.

Abstract: The present invention relates to an aqueous electrochemical energy storage apparatus which comprises an electrochemical energy storage device comprising an electrochemical energy storage device with an inlet and outlet and respectively connected to an external fluid circulation apparatus that facilitates the fluid circulation entering and exiting the said energy storage device, to regulate the physical, chemical, and electrochemical conditions within the said energy storage device. The present invention also relates to a method for optimizing or restoring the electrochemical performance of an energy storage device, enhancing various performance and greatly extending the service life thereof by upgrading the electrolyte inside and outside the energy storage device.

Abstract: A circular plastic container locking mechanism includes a barrel body and a barrel cover; when the barrel body is stationary, the gear handle drives the gear to rotate towards a counter-clockwise direction, and with the rotating function of the gear, the rack on the barrel cover and the whole barrel cover are driven to move towards a clockwise direction, ten times the force for locking the barrel body and the barrel cover up and down can be produced with only a small amount of force by utilizing the lever effect of the gear handle and the effect of thread slope movement on the gear to lock the barrel cover and the barrel body; when the gear handle swings towards the clockwise direction, the barrel cover moves towards the counter-clockwise direction, and then the barrel cover is unlocked; and therefore locking and unlocking are very convenient.

Abstract: A method supports, on a printed circuit board, a circuit package including a substrate having a solder column array. The method comprises providing the circuit package with an over-sized lid that extends outwardly over an edge of the substrate. The circuit package is electrically connected to the printed circuit board via the solder column array and a plurality of supports are secured to the printed circuit board in position underneath the lid of the circuit package while leaving a gap between the lid and the support. A static compressive force is applied and maintained to the circuit package relative to the printed circuit board, thereby causing the solder column array to creep until the gap is closed and a substantial portion of the compressive force is borne by the supports.

Abstract: A fixture can be placed onto a printed circuit board in an aligned position and a component can be guided into the fixture and onto the printed circuit board. The fixture coarsely aligns the component with the printed circuit board.

Abstract: A method for mechanically supporting a integrated circuit (IC) package having a column grid array (CGA) interconnection with a printed circuit board (PCB) is provided by inserting a supporting device between the IC package and the PCB after the IC package is solder attached to the PCB. The supporting device is removably and mechanically fastened to the PCB and is designed in such a shape so that the supporting device cannot come into contact with the solder columns of the CGA to cause damage or shorting. This invention eliminates the maximum retention load constraint of the IC package and enables a wide variety of thermal solution implementations without comprising reliability.

Abstract: A method for mechanically supporting a integrated circuit (IC) package having a column grid array (CGA) interconnection with a printed circuit board (PCB) is provided by inserting a supporting device between the IC package and the PCB after the IC package is solder attached to the PCB. The supporting device is removably and mechanically fastened to the PCB and is designed in such a shape so that the supporting device cannot come into contact with the solder columns of the CGA to cause damage or shorting. This invention eliminates the maximum retention load constraint of the IC package and enables a wide variety of thermal solution implementations without comprising reliability.

Abstract: A method supports, on a printed circuit board, a circuit package including a substrate having a solder column array. The method comprises providing the circuit package with an over-sized lid that extends outwardly over an edge of the substrate. The circuit package is electrically connected to the printed circuit board via the solder column array and a plurality of supports are secured to the printed circuit board in position underneath the lid of the circuit package while leaving a gap between the lid and the support. A static compressive force is applied and maintained to the circuit package relative to the printed circuit board, thereby causing the solder column array to creep until the gap is closed and a substantial portion of the compressive force is borne by the supports.

Abstract: A component of an attach hardware assembly is configured for use in securing an Application Specific Integrated Circuit (ASIC) to a circuit board as part of the attach hardware assembly and has a protective coating to protect that component from corrosion.

Abstract: An assembly is provided having a first circuit board and a second circuit board, each circuit board having a plurality of electrical connection points, electrical connection points on the first circuit board being connected to specified electrical connection points on the second circuit board by solder structures, the first and second circuit boards being stacked with respect to each other and with a defined standoff distance there between, the assembly comprising one or more stops having an inserted portion placed between the first and second circuit board along the perimeter of at least one of the electrical circuit boards, the inserted portion of each of the stops having a fixed, predetermined height.