Patents by Inventor Xiang Hua Cui

Xiang Hua Cui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor integrated circuit
    Patent number: 8748888
    Abstract: A semiconductor integrated circuit includes a multi-chip package having a plurality of semiconductor chips. The semiconductor integrated circuit includes a signal line; and a signal loading compensation section in a semiconductor chip among the plurality of semiconductor chips, configured to apply a designed signal loading to the signal line in response to activation of a test signal. Here, the designed signal loading has a value corresponding to a signal loading component of another semiconductor chip among the plurality of semiconductor chips to the signal line.
    Type: Grant
    Filed: December 29, 2009
    Date of Patent: June 10, 2014
    Assignee: SK Hynix Inc.
    Inventors: Jeong Woo Lee, Hyung Dong Lee, Jun Gi Choi, Sang Hoon Shin, Xiang Hua Cui
  • Repair circuit and repair method of semiconductor apparatus
    Patent number: 8514641
    Abstract: A repair circuit of a semiconductor apparatus includes a plurality of through-silicon vias including repeated sets of one repair through-silicon via and an M number of normal through-silicon vias; a transmission unit configured to multiplex input data at a first multiplexing rate based on control signals, and transmit the multiplexed data to the plurality of through-silicon vias; a reception unit configured to multiplex signals transmitted through the plurality of through-silicon vias at a second multiplexing rate based on the control signals, and generate output data; and a control signal generation unit configured to generate sets of the control signals based on an input number of a test signal.
    Type: Grant
    Filed: July 20, 2010
    Date of Patent: August 20, 2013
    Assignee: SK Hynix Inc.
    Inventors: Xiang Hua Cui, Jeong Woo Lee, Sang Hoon Shin
  • REPAIR CIRCUIT AND REPAIR METHOD OF SEMICONDUCTOR APPARATUS
    Publication number: 20110156034
    Abstract: A repair circuit of a semiconductor apparatus includes a plurality of through-silicon vias including repeated sets of one repair through-silicon via and an M number of normal through-silicon vias; a transmission unit configured to multiplex input data at a first multiplexing rate based on control signals, and transmit the multiplexed data to the plurality of through-silicon vias; a reception unit configured to multiplex signals transmitted through the plurality of through-silicon vias at a second multiplexing rate based on the control signals, and generate output data; and a control signal generation unit configured to generate sets of the control signals based on an input number of a test signal.
    Type: Application
    Filed: July 20, 2010
    Publication date: June 30, 2011
    Applicant: Hynix Semiconductor Inc.
    Inventors: Xiang Hua Cui, Jeong Woo Lee, Sang Hoon Shin
  • SEMICONDUCTOR INTEGRATED CIRCUIT
    Publication number: 20110024743
    Abstract: A semiconductor integrated circuit includes a multi-chip package having a plurality of semiconductor chips. The semiconductor integrated circuit includes a signal line; and a signal loading compensation section in a semiconductor chip among the plurality of semiconductor chips, configured to apply a designed signal loading to the signal line in response to activation of a test signal. Here, the designed signal loading has a value corresponding to a signal loading component of another semiconductor chip among the plurality of semiconductor chips to the signal line.
    Type: Application
    Filed: December 29, 2009
    Publication date: February 3, 2011
    Applicant: HYNIX SEMICONDUCTOR INC.
    Inventors: Jeong Woo LEE, Hyung Dong Lee, Jun Gi Choi, Sang Hoon Shin, Xiang Hua Cui