Patents by Inventor Xiang Mei Chen

Xiang Mei Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240099920
    Abstract: A method for controlling a device for automatically adjusting an airway opening body position is provided. The device includes a horizontal base plate, a head support block, a back support plate, a neck support apparatus, a head cover assembly, and a programmable logic controller (PLC). The neck support apparatus is positioned between the head support block and the back support plate. The PLC is configured to controls a stroke of an electric cylinder according to the following equations: ?=1.235?+?, and ?=KX+B+C, where ? is a body position angle, the body position angle is an angle between a positive projection line of a connecting line from a mandibular angle to an external acoustic meatus on a symmetrical surface of a human body and the back support plate, and ? is a preset value ranging from 90° to 100°.
    Type: Application
    Filed: November 14, 2022
    Publication date: March 28, 2024
    Inventors: XIANG-MEI YANG, MIN-YUE SUN, HONG-MEI CHEN, YAN LUO, JUN WU, JUAN HUANG, DONG-MEI LI, QING ZENG, JING ZHOU, JING WEN, JIN-JIN GUO
  • Patent number: 11853516
    Abstract: A protective assembly includes a cover plate, a buffer layer, and a flexible substrate. The buffer layer is disposed on the cover plate and made of transparent polymer. The buffer layer has a light transmittance greater than about 85%, a thickness ranging from about 3 ?m to about 15 ?m, and a Poisson's ratio greater than about 0.4. The flexible substrate is disposed on the buffer layer and doped with an inorganic compound. The flexible substrate has a thickness ranging from about 3 ?m to about 10 ?m and a Young's coefficient ranging from about 1 GPa to about 10 GPa.
    Type: Grant
    Filed: December 14, 2021
    Date of Patent: December 26, 2023
    Assignee: TPK ADVANCED SOLUTIONS INC.
    Inventors: Jen-Chang Liu, Xiang Mei Chen, Lian Jie Ji, Lien-Hsin Lee, Tai-Shih Cheng
  • Publication number: 20230185410
    Abstract: A protective assembly includes a cover plate, a buffer layer, and a flexible substrate. The buffer layer is disposed on the cover plate and made of transparent polymer. The buffer layer has a light transmittance greater than about 85%, a thickness ranging from about 3 ?m to about 15 ?m, and a Poisson's ratio greater than about 0.4. The flexible substrate is disposed on the buffer layer and doped with an inorganic compound. The flexible substrate has a thickness ranging from about 3 ?m to about 10 ?m and a Young's coefficient ranging from about 1 GPa to about 10 GPa.
    Type: Application
    Filed: December 14, 2021
    Publication date: June 15, 2023
    Inventors: Jen-Chang Liu, Xiang Mei Chen, Lian Jie Ji, Lien-Hsin Lee, Tai-Shih Cheng
  • Patent number: 11586312
    Abstract: A touch module includes a substrate, a bridging pattern layer, first and second insulating layers, and an electrode pattern layer. The bridging pattern layer, disposed on the substrate, includes a bridging electrode. The first insulating layer, disposed on the bridging pattern layer, includes first and second insulating blocks respectively formed at opposite ends of the bridging electrode and a third insulating block separately located between the first and second insulating blocks by two exposed regions of the first insulating layer. The electrode pattern layer, disposed on the first insulating layer, is electrically connected to the bridging electrode through the two exposed regions. The electrode pattern layer includes first and second transparent conductive layers and a metal layer and has two through hole regions directly above the bridging electrode. The second insulating layer, disposed on the electrode pattern layer, covers and fills the two through hole regions.
    Type: Grant
    Filed: November 10, 2021
    Date of Patent: February 21, 2023
    Assignee: TPK Advanced Solutions Inc.
    Inventors: Xiang Mei Chen, Lian Jie Ji, Lien-Hsin Lee, Tai-Shih Cheng