Abstract: Immersion cooling systems are disclosed. An example immersion cooling system includes an immersion tank including a cooling fluid and a reservoir to contain a recirculated portion of the cooling fluid. The reservoir is separated from the immersion tank by a height to generate a liquid surface height variance between the cooling fluid in the immersion tank and the cooling fluid in the reservoir. A supply conduit is to fluidly couple the immersion tank and the reservoir. The cooling fluid to be provided from the reservoir to the immersion tank via gravity.

Abstract: An apparatus is described that includes an immersion bath chamber and a cover that is to seal the immersion bath chamber. An apparatus is described that includes an immersion bath chamber and an installable/removable transfer member. The installable/removable transfer member has fluidic connectors designed to couple to respective warmed fluid flow output ports of pluggable units to be cooled in the immersion bath chamber and having respective backplane interface designs. An apparatus is described that includes an immersion bath chamber and an overflow chamber. The overflow chamber is to receive an overflow of liquid coolant from the immersion bath chamber, wherein a first exit flow channel from the overflow chamber is coupled to a second exit fluid flow channel from the immersion bath chamber through a valve, wherein, an opening of the valve is controllable to vary a gravitational fluid flow within the immersion bath chamber.

Abstract: Heat pipes and vapor chambers that are components of a DIMM cooling assembly are described.

Abstract: Methods and apparatus for immersion cooling systems are disclosed herein. An example apparatus includes a base plate, fins extending from the base plate, a tube extending along an axis through the fins, the tube including an inlet, and a slot extending along the axis, the inlet, the slot, and the fins sequentially defining a flow pathway.

Abstract: Techniques for heat sinks and cold plates for compute systems are disclosed. In one embodiment, a heat sink includes two sub-heat sinks that are mechanically connected but thermally isolated. The two sub-heat sinks can independently cool different dies on the same integrated circuit component. In another embodiment, a system includes an integrated circuit component that is cooled by a first water block and a second water block. The first water block forms a loop with a gap in it, and the second water block has a pedestal that extends through the gap in the first water block to contact the integrated circuit component. The first water block and the second water block can independently cool different dies on the same integrated circuit component.

Abstract: An apparatus is described that includes a flow enhancement structure to enhance a flow of immersion bath liquid specifically through space between fins of a heat sink and/or across a base of a heat sink.