Abstract: A fan test device is connected to an interface of a fan under test on a motherboard. The fan test device includes a connector, a power test unit, a signal test unit, a single chip microcontroller (SCM), and a keyboard. The power test unit includes a first contact and a second contact. The first contact is connected to a ground pin of the connector. The second contact is connected to a power pin of the connector. The signal test unit includes a third contact and a fourth contact. The third contact is connected to the first contact. The fourth contact is connected to a pulse width modulation (PWM) signal pin of the connector. The keyboard is connected to the SCM to input a max speed and a preset duty cycle of the fan.

Abstract: A heat dissipation device includes a base for being contacted with a heat-generating element mounted on a circuit board, two frames rotatably mounted to the base, and a thermal module secured to the base. A slot is defined in each frame for allowing a fastener to extend through to engage in the circuit board.