Abstract: A wafer-level assembly method for a micro hemispherical resonator gyroscope includes: after independently manufactured glass substrates are softened and deformed at a high temperature, forming a micro hemispherical resonator on the glass substrate; forming glass substrate alignment holes at both ends of the glass substrate by laser ablation; aligning and fixing a plurality of identical micro hemispherical resonators on a wafer fixture by using the alignment holes as a reference, and then performing operations by using the wafer fixture as a unit to implement subsequent processes that include: releasing the micro hemispherical resonators, metallizing the surface, fixing to the planar electrode substrates, separating the wafer fixture and cleaning to obtain a micro hemispherical resonator gyroscope driven by a bottom planar electrode substrate.

Abstract: An elastically supported electrode substrate for detecting unbalanced mass of a resonant gyroscope includes an outer frame and an inner structure. A connection part configured to be connected to an anchor of a resonator is arranged at the center of the inner structure, and electrodes are distributed on the inner structure. The inner structure is connected inside the outer frame through elastic beams, and the inner structure has torsional and/or translational resonant modes inside the outer frame. The resonant frequency of the inner structure approaches resonant frequency of an operating mode of the resonator. Since the resonant frequency of the elastically supported electrode substrate approaches the resonant frequency of the operating mode of the resonator, the vibration displacement induced by the unbalanced mass of the elastically supported electrode substrate can be significantly magnified to improve the detection sensitivity.

Abstract: An elastically supported electrode substrate for detecting unbalanced mass of a resonant gyroscope includes an outer frame and an inner structure. A connection part configured to be connected to an anchor of a resonator is arranged at the center of the inner structure, and electrodes are distributed on the inner structure. The inner structure is connected inside the outer frame through elastic beams, and the inner structure has torsional and/or translational resonant modes inside the outer frame. The resonant frequency of the inner structure approaches resonant frequency of an operating mode of the resonator. Since the resonant frequency of the elastically supported electrode substrate approaches the resonant frequency of the operating mode of the resonator, the vibration displacement induced by the unbalanced mass of the elastically supported electrode substrate can be significantly magnified to improve the detection sensitivity.

Abstract: An online trimming device and method for a micro-shell resonator gyroscope is provided. A micro-shell resonator gyroscope fixing fixture and a mode test circuit in the device are placed in a vacuum test cavity provided with a circuit interface. The mode test circuit and a host computer are connected through a circuit interface on the vacuum test cavity. The gyroscope fixing fixture is provided with a signal interface, and the electrodes on the gyroscope substrate are connected to the signal interface. The signal interface on the fixture is connected to the mode test circuit. The laser etching module is located at the top of the device. An opening is formed in the gyroscope fixing fixture. The vacuum test cavity is provided with a transparent trimming window. The laser acts on the edge of the resonant structure of the gyroscope through the trimming window and the through hole of the fixture.

Abstract: A wafer-level assembly method for a micro hemispherical resonator gyroscope includes: after independently manufactured glass substrates are softened and deformed at a high temperature, forming a micro hemispherical resonator on the glass substrate; forming glass substrate alignment holes at both ends of the glass substrate by laser ablation; aligning and fixing a plurality of identical micro hemispherical resonators on a wafer fixture by using the alignment holes as a reference, and then performing operations by using the wafer fixture as a unit to implement subsequent processes that include: releasing the micro hemispherical resonators, metallizing the surface, fixing to the planar electrode substrates, separating the wafer fixture and cleaning to obtain a micro hemispherical resonator gyroscope driven by a bottom planar electrode substrate.