Abstract: Disclosed is a copolymer, including a structural unit formed from phenylvinylsilane and vinyl-containing compound A; the raw materials of the copolymer include phenylvinylsilane and vinyl-containing compound A; based on a total weight of phenylvinylsilane and the vinyl-containing compound A being 100 parts by weight, phenylvinylsilane is 80 to 98 parts by weight, and vinyl-containing compound A is 2 to 20 parts by weight. Also disclosed is a method of preparing the copolymer, including performing a reaction of 80 to 98 parts by weight of phenylvinylsilane and 2 to 20 parts by weight of vinyl-containing compound A. Also disclosed is a resin composition including the copolymer, a method of preparing the resin composition, a use of the resin composition in preparing a product, and a product of which at least a portion is made from the resin composition.

Abstract: A resin composition is disclosed, comprising 100 parts by weight of a copolymer of phenylvinylsilane and alkenyl compound and 20 parts by weight to 100 parts by weight of a vinylbenzyl-terminated phenolic resin; wherein the raw material of the copolymer of phenylvinylsilane and alkenyl compound comprises a phenylvinylsilane and an alkenyl compound, based on a total weight of the phenylvinylsilane and the alkenyl compound being 100 parts by weight, the phenylvinylsilane is 80 parts by weight to 98 parts by weight, and the alkenyl compound is 2 parts by weight to 20 parts by weight. The resin composition can be made into a product such as a prepreg, a resin film, a laminate, a printed circuit board or a cured insulator.

Abstract: The present disclosure relates to a transmission structure and a preparation method thereof. The transmission structure includes a plurality of first transmission units and a plurality of second transmission units, and difference between a first transmission phase of a transmitted electromagnetic wave of the first transmission unit and a second transmission phase of a transmitted electromagnetic wave of the second transmission unit is the same or similar within a preset frequency range. The plurality of first and second transmission units are arranged randomly on a surface. The first transmission unit has a first matrix, a first medium block is disposed inside the first matrix, and a thickness of the first matrix between the first medium block and an electromagnetic wave incident surface of the first transmission unit is a non-zero first thickness.

Abstract: A long-term ablation-resistant nitrogen-containing carbide ultra-high temperature ceramic with an ultra-high melting point is prepared as follows: preparing the HfC powder and the HfN powder according to a mass ratio of HfC:HfN=(1-7):1; uniformly mixing the HfC powder and the HfN powder with the carbon powder and the carbon nitride powder to obtain a mixed powder, wherein the amount of the carbon powder and the amount of the carbon nitride powder do not exceed 8.0 wt. % and 5.0 wt. %, respectively, of the mixed powder mass; and performing spark plasma sintering on the mixed powder to produce the ceramic with the ultra-high melting point, a density ?98%, and a uniform C/N content distribution. The ultra-high temperature ceramic is suitable for ultra-high temperature ablation-resistant protection at ?3000° C. The ceramic maintains a close to zero ablation rate and a continuously stable oxidation-resistant protective structure after ablation for 300 s.

Abstract: A resin composition includes 100 parts by weight of a vinyl group-containing polyphenylene ether resin, 5 parts by weight to 30 parts by weight of a maleimide resin, 5 parts by weight to 40 parts by weight of an active ester and 5 parts by weight to 40 parts by weight of a phosphate ester, wherein the resin composition does not include an epoxy resin. Moreover, also provided is an article made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board, and the various properties can be improved including dissipation factor, dissipation factor after thermal aging, dissipation factor variation rate after thermal aging, copper foil peeling strength and alkali resistance.

Abstract: A computer-implemented method according to one embodiment includes generating a first matrix based on words extracted from documents, and generating a second matrix based on deduplication chunks. The deduplication chunks include words of the documents. Word clustering is performed based on an analysis performed on the second matrix. Each cluster of the words represents a feature of at least one of the documents. The method further includes generating a third matrix based on the first matrix and the clusters, and performing text mining using the third matrix. A computer program product according to another embodiment includes a computer readable storage medium having program instructions embodied therewith. The program instructions are readable and/or executable by a computer to cause the computer to perform the foregoing method.

Abstract: A long-term ablation-resistant nitrogen-containing carbide ultra-high temperature ceramic with an ultra-high melting point is prepared as follows: preparing the HfC powder and the HfN powder according to a mass ratio of HfC:HfN=(1-7):1; uniformly mixing the HfC powder and the HfN powder with the carbon powder and the carbon nitride powder to obtain a mixed powder, wherein the amount of the carbon powder and the amount of the carbon nitride powder do not exceed 8.0 wt. % and 5.0 wt. %, respectively, of the mixed powder mass; and performing spark plasma sintering on the mixed powder to produce the ceramic with the ultra-high melting point, a density ?98%, and a uniform C/N content distribution. The ultra-high temperature ceramic is suitable for ultra-high temperature ablation-resistant protection at ?3000° C. The ceramic maintains a close to zero ablation rate and a continuously stable oxidation-resistant protective structure after ablation for 300 s.

Abstract: A resin composition includes a vinyl-containing polyphenylene ether resin and a multifunctional vinylsilane. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board and achieve improvement in at least one of the properties including prepreg or laminate surface appearance, glass transition temperature, ratio of thermal expansion, peel strength, thermal resistance after moisture absorption, thermal resistance, dielectric constant, dissipation factor and inner resin flow.

Abstract: An electrical connector includes an insulating body having a bottom wall, an accommodating cavity provided above the bottom wall, and two side walls at left and right sides of the accommodating cavity. Each side wall has a reserved slot running through the corresponding side wall in a left-right direction and in communication with the accommodating cavity. The insulating body has an oblique surface at a bottom portion of the reserved slot, which is provided obliquely downward and outward, and has an inner edge and an outer edge. The outer edge is lower than a top surface of the bottom wall. Each side wall is further concavely provided with multiple notches at front and back sides of the corresponding reserved slot. Each notch runs along the left-right direction and upward through the corresponding side wall. A lower edge of each notch is higher than the corresponding oblique surface.

Abstract: A resin composition includes a vinyl-containing polyphenylene ether resin and a multifunctional vinylsilane. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board and achieve improvement in at least one of the properties including prepreg or laminate surface appearance, glass transition temperature, ratio of thermal expansion, peel strength, thermal resistance after moisture absorption, thermal resistance, dielectric constant, dissipation factor and inner resin flow.

Abstract: Disclosed is an assembly comprising an insulation material and a copper foil disposed on the insulation material, wherein the copper foil has a thickness of less than or equal to 6 ?m, and the insulation material is made from a resin composition comprising oxazolidone epoxy resin, oxydianiline type benzoxazine resin and a curing agent. The assembly achieves desirable balanced properties in peel strength, glass transition temperature, dimensional change after reflow, thermal resistance, and dielectric properties.

Abstract: A method for preparing a ceramic-modified carbon-carbon composite material. The method includes preparing and thermally treating a carbon fiber preform, and depositing pyrolytic carbon on the carbon fiber preform in a chemical vapor infiltration furnace, to yield a porous carbon-carbon composite material; placing the carbon-carbon composite material deposited with the pyrolytic carbon on a zirconium-titanium powder mixture, and performing a reactive melt infiltration, to yield a carbon-carbon composite material modified by non-stoichiometric zirconium titanium carbide; and placing the carbon-carbon composite material modified by non-stoichiometric zirconium titanium carbide in a powder mixture including carbon, boron carbide, silicon carbide, silicon, and an infiltration enhancer, and performing an embedding method, to form a ceramic-modified carbon-carbon composite material.

Abstract: A method for preparing a ceramic-modified carbon-carbon composite material. The method includes preparing and thermally treating a carbon fiber preform, and depositing pyrolytic carbon on the carbon fiber preform in a chemical vapor infiltration furnace, to yield a porous carbon-carbon composite material; placing the carbon-carbon composite material deposited with the pyrolytic carbon on a zirconium-titanium powder mixture, and performing a reactive melt infiltration, to yield a carbon-carbon composite material modified by non-stoichiometric zirconium titanium carbide; and placing the carbon-carbon composite material modified by non-stoichiometric zirconium titanium carbide in a powder mixture including carbon, boron carbide, silicon carbide, silicon, and an infiltration enhancer, and performing an embedding method, to form a ceramic-modified carbon-carbon composite material.

Abstract: Disclosed is an assembly comprising an insulation material and a copper foil disposed on the insulation material, wherein the copper foil has a thickness of less than or equal to 6 ?m, and the insulation material is made from a resin composition comprising oxazolidone epoxy resin, oxydianiline type benzoxazine resin and a curing agent. The assembly achieves desirable balanced properties in peel strength, glass transition temperature, dimensional change after reflow, thermal resistance, and dielectric properties.

Abstract: Provided is a resin composition, comprising epoxy resin, oxydianiline type benzoxazine resin, styrene-maleic anhydride resin and tetra-phenol resin. The resin composition may be baked for producing products such as prepregs, resin films, resin-coated coppers, laminates and printed circuit boards, which satisfy one or more or all of desirable properties such as higher dimensional stability after a reflow process, better thermal resistance after horizontal black oxide process, low dielectric constant, low dissipation factor, high thermal resistance and flame retardancy.

Abstract: Provided is a phosphaphenanthrene-based compound represented by the following chemical structure: The phosphaphenanthrene-based compound can be added in a resin composition and made into a prepreg or resin film. The prepreg or resin film made from such resin composition has low coefficient of thermal expansion, low dielectric constant and dissipation factor, and flame retardancy, thereby being suitable for copper-clad laminate or printed circuit board.

Abstract: Provided is a resin composition, comprising epoxy resin, oxydianiline type benzoxazine resin, styrene-maleic anhydride resin and tetra-phenol resin. The resin composition may be baked for producing products such as prepregs, resin films, resin-coated coppers, laminates and printed circuit boards, which satisfy one or more or all of desirable properties such as higher dimensional stability after a reflow process, better thermal resistance after horizontal black oxide process, low dielectric constant, low dissipation factor, high thermal resistance and flame retardancy.

Abstract: Provided is a phosphaphenanthrene-based compound represented by the following chemical structure: The phosphaphenanthrene-based compound can be added in a resin composition and made into a prepreg or resin film. The prepreg or resin film made from such resin composition has low coefficient of thermal expansion, low dielectric constant and dissipation factor, and flame retardancy, thereby being suitable for copper-clad laminate or printed circuit board.

Abstract: In the technical field of data storage and access, the invention relates to the technique of data transmission using a storage area network (SAN) in a magnetic disk storage device environment, including a method for transmitting data over a SAN in such an environment, including: determining a logical volume accessible to a server of the magnetic disk storage device; obtaining information on a logical volume accessible to a client of the magnetic disk storage device, which is determined by the client; establishing a corresponding relationship between the logical volume accessible to the server and the logical volume accessible to the client; receiving a request for using the logical volume of the magnetic disk storage device from the client; and informing the client of an available logical volume by utilizing the corresponding relationship so that a data access to the available logical volume is performed by the client over the SAN.

Abstract: In the technical field of data storage and access, the invention relates to the technique of data transmission using a storage area network (SAN) in a magnetic disk storage device environment, including a method for transmitting data over a SAN in such an environment, including: determining a logical volume accessible to a server of the magnetic disk storage device; obtaining information on a logical volume accessible to a client of the magnetic disk storage device, which is determined by the client; establishing a corresponding relationship between the logical volume accessible to the server and the logical volume accessible to the client; receiving a request for using the logical volume of the magnetic disk storage device from the client; and informing the client of an available logical volume by utilizing the corresponding relationship so that a data access to the available logical volume is performed by the client over the SAN.