Abstract: Embodiments include a cooling device for a medical device. The cooling device including a controller configured to receive data from one or more temperature sensors and a pump, configured to be operated by the controller, to circulate a cooling fluid through a cooling system and through fluid channels in the medical device. The cooling device is configured to be worn by a user and to be selectively coupled to the medical device by the user.

Abstract: A portable electronic device can include a housing at least partially defining an internal volume, a set of temperature sensors disposed in the internal volume, a display assembly, and a processor or main logic board. The set of temperature sensors can be positioned adjacent to or affixed to components of the portable electronic device. The processor can determine a temperature of an environment based on an adjustment factor and weighted temperature measurements taken by a subset of the set of temperature sensors.

Abstract: Embodiments include a cooling device for a medical device. The cooling device including a controller configured to receive data from one or more temperature sensors and a pump, configured to be operated by the controller, to circulate a cooling fluid through a cooling system and through fluid channels in the medical device. The cooling device is configured to be worn by a user and to be selectively coupled to the medical device by the user.

Abstract: A method for increasing temperature of a battery pack includes determining whether a temperature of a cell in the battery pack is above a lower threshold temperature. The method further includes charging, by a current directly from a charger, a balancing circuit including a resistor in proximity to the cell. The method also includes increasing the temperature of the cell in the battery pack.

Abstract: Methods, systems, and assemblies for cooling an electronic component are disclosed. A heat sink assembly includes first and second substrates. The first substrate is in thermal contact with the electronic component. A primary channel is formed in the second surface of the first substrate. The primary channel is configured to direct cooling fluid for cooling the electronic component. An array of primary cooling fluid fins is positioned within the primary channel. The array of primary cooling fluid fins includes upstream solid fins and downstream open fins each having an upstream opening and downstream sidewalls. The secondary channel is formed within the second surface of the second substrate and is configured to direct partially heated cooling fluid away from the electronic component. An array of secondary cooling fluid fins is positioned within the secondary channel downstream. An enclosing layer seals the secondary channel.

Abstract: A cold plate is provided and includes fins defining first channels, a plenum adjacent to an upstream end of each of the first channels, a lid, ribs and a blocking element. The lid defines an inlet fluidly communicative with the plenum. The ribs extend between the lid and the fins to define second channels oriented transversely relative to the first channels. The second channels include a proximal second channel fluidly communicative with the plenum. The blocking element is configured to normally encourage coolant flowing through the inlet to flow toward the plenum and the upstream end of each of the first channels and to normally discourage the coolant from flowing into the proximal second channel.

Abstract: A cold plate is provided and includes fins defining first channels, a plenum adjacent to an upstream end of each of the first channels, a lid, ribs and a blocking element. The lid defines an inlet fluidly communicative with the plenum. The ribs extend between the lid and the fins to define second channels oriented transversely relative to the first channels. The second channels include a proximal second channel fluidly communicative with the plenum. The blocking element is configured to normally encourage coolant flowing through the inlet to flow toward the plenum and the upstream end of each of the first channels and to normally discourage the coolant from flowing into the proximal second channel.

Abstract: A method for increasing temperature of a battery pack includes determining whether a temperature of a cell in the battery pack is above a lower threshold temperature. The method further includes charging, by a current directly from a charger, a balancing circuit including a resistor in proximity to the cell. The method also includes increasing the temperature of the cell in the battery pack.

Abstract: Methods, systems, and assemblies for cooling an electronic component are disclosed. A heat sink assembly includes first and second substrates. The first substrate is in thermal contact with the electronic component. A primary channel is formed in the second surface of the first substrate. The primary channel is configured to direct cooling fluid for cooling the electronic component. An array of primary cooling fluid fins is positioned within the primary channel. The array of primary cooling fluid fins includes upstream solid fins and downstream open fins each having an upstream opening and downstream sidewalls. The secondary channel is formed within the second surface of the second substrate and is configured to direct partially heated cooling fluid away from the electronic component. An array of secondary cooling fluid fins is positioned within the secondary channel downstream. An enclosing layer seals the secondary channel.

Abstract: Methods, systems, and assemblies for cooling an electronic component are disclosed. A heat sink assembly includes first and second substrates. The first substrate is in thermal contact with the electronic component. A primary channel is formed in the second surface of the first substrate. The primary channel is configured to direct cooling fluid for cooling the electronic component. An array of primary cooling fluid fins is positioned within the primary channel. The array of primary cooling fluid fins includes upstream solid fins and downstream open fins each having an upstream opening and downstream sidewalls. The secondary channel is formed within the second surface of the second substrate and is configured to direct partially heated cooling fluid away from the electronic component. An array of secondary cooling fluid fins is positioned within the secondary channel downstream. An enclosing layer seals the secondary channel.

Abstract: Methods, systems, and assemblies for cooling an electronic component are disclosed. A heat sink assembly includes first and second substrates. The first substrate is in thermal contact with the electronic component. A primary channel is formed in the second surface of the first substrate. The primary channel is configured to direct cooling fluid for cooling the electronic component. An array of primary cooling fluid fins is positioned within the primary channel. The array of primary cooling fluid fins includes upstream solid fins and downstream open fins each having an upstream opening and downstream sidewalls. The secondary channel is formed within the second surface of the second substrate and is configured to direct partially heated cooling fluid away from the electronic component. An array of secondary cooling fluid fins is positioned within the secondary channel downstream. An enclosing layer seals the secondary channel.