Patents by Inventor Xianghe ZENG

Xianghe ZENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11692536
    Abstract: The present disclosure provides a vacuum pumping device and a food processor. The vacuum pumping device includes an upper cover; a lower cover configured to cooperated with the upper cover to form a receiving cavity and including a connecting part at a lower portion of the lower cover, a wall of the receiving cavity defining an evacuation hole and an exhaust hole; a mounting support located in the receiving cavity and connected to the upper cover and/or the lower cover; a vacuum pump connected to the mounting support, and including an air inlet communicating with the evacuation hole and an air outlet communicating with the exhaust hole; a control circuit board connected to the mounting support and electrically connected to the vacuum pump; and a power supply device located in the receiving cavity and electrically connected to the control circuit board.
    Type: Grant
    Filed: August 7, 2018
    Date of Patent: July 4, 2023
    Inventors: Jianfei Xu, Rong Liu, Dan Wu, Xianghe Zeng, Yan Tang
  • Patent number: 11621349
    Abstract: A nano-wall integrated circuit structure with high integration density is disclosed, which relates to the fields of microelectronic technology and integrated circuits (IC). Based on the different device physical principles with MOSFETs in traditional ICs, the nano-wall integrated circuit unit structure (Nano-Wall FET, referred to as NWaFET) with high integration density can improve the integration of the IC, significantly shorten the channel length, improve the flexibility of the device channel width-to-length ratio adjustment, and save chip area.
    Type: Grant
    Filed: July 5, 2021
    Date of Patent: April 4, 2023
    Assignee: University of Electronic Science and Technology of China
    Inventors: Ping Li, Yongbo Liao, Xianghe Zeng, Yaosen Li, Ke Feng, Chenxi Peng, Zhaoxi Hu, Fan Lin, Xuanlin Xiong, Tao He
  • Patent number: 11602243
    Abstract: The present disclosure provides a food processor, comprising: a cutter head, wherein a cutter is arranged on the cutter head, the intersecting line of the side wall of the cutter head and the cross section of the cutter head is a cutter head contour line, the maximum inscribed circle or the minimum circumscribed circle of the cutter head contour line is a cutter head base circle, and the central axis of the cutter head penetrates the center of the cutter head base circle; and a cup body arranged on the cutter head, wherein the intersecting line of the cup wall of the cup body and the cross section of the cup wall is a cup body contour line, the maximum inscribed circle or the minimum circumscribed circle of the cup body contour line is a cup body base circle.
    Type: Grant
    Filed: January 28, 2019
    Date of Patent: March 14, 2023
    Assignees: GUANGDONG MIDEA CONSUMER ELECTRICS MANUFACTURING CO., LTD., MIDEA GROUP CO., LTD.
    Inventors: Qian Fan, Xianghe Zeng, Jianfei Xu
  • Patent number: 11335785
    Abstract: A MOS integrated circuit basic unit includes: a drain semiconductor region; a lightly doped drain region; a channel semiconductor region; a source semiconductor region; a source electrode; a gate electrode; a gate dielectric layer; and a drain electrode. The drain semiconductor region is the bottom of the basic unit. The gate electrode has a ring structure, which surrounds the channel semiconductor region, the source semiconductor region and the lightly doped drain region. The upper surface of the gate electrode is aligned to the upper surface of the source semiconductor region; and a bottom surface of the gate electrode is lower than an interface of the lightly doped drain region and the drain semiconductor region. The gate dielectric layer is disposed between the gate electrode and the adjacent functional layer. The drain semiconductor region is connected to the drain electrode of the basic unit.
    Type: Grant
    Filed: December 18, 2020
    Date of Patent: May 17, 2022
    Assignee: UNIVERSITY OF ELECTRONIC SCIENCE AND TECHNOLOGY OF CHINA
    Inventors: Ping Li, Yongbo Liao, Chenxi Peng, Yaosen Li, Ruihong Nie, Ke Feng, Xianghe Zeng, Ruifeng Tang, Jiarui Zou, Zhaoxi Hu, Fan Lin
  • Publication number: 20220149198
    Abstract: A nano-wall integrated circuit structure with high integration density is disclosed, which relates to the fields of microelectronic technology and integrated circuits (IC). Based on the different device physical principles with MOSFETs in traditional ICs, the nano-wall integrated circuit unit structure (Nano-Wall FET, referred to as NWaFET) with high integration density can improve the integration of the IC, significantly shorten the channel length, improve the flexibility of the device channel width-to-length ratio adjustment, and save chip area.
    Type: Application
    Filed: July 5, 2021
    Publication date: May 12, 2022
    Inventors: Ping LI, Yongbo LIAO, Xianghe ZENG, Yaosen LI, Ke FENG, Chenxi PENG, Zhaoxi HU, Fan LIN, Xuanlin XIONG, Tao HE
  • Publication number: 20210226022
    Abstract: A MOS integrated circuit basic unit includes: a drain semiconductor region; a lightly doped drain region; a channel semiconductor region; a source semiconductor region; a source electrode; a gate electrode; a gate dielectric layer; and a drain electrode. The drain semiconductor region is the bottom of the basic unit. The gate electrode has a ring structure, which surrounds the channel semiconductor region, the source semiconductor region and the lightly doped drain region. The upper surface of the gate electrode is aligned to the upper surface of the source semiconductor region; and a bottom surface of the gate electrode is lower than an interface of the lightly doped drain region and the drain semiconductor region. The gate dielectric layer is disposed between the gate electrode and the adjacent functional layer. The drain semiconductor region is connected to the drain electrode of the basic unit.
    Type: Application
    Filed: December 18, 2020
    Publication date: July 22, 2021
    Inventors: Ping LI, Yongbo LIAO, Chenxi PENG, Yaosen LI, Ruihong NIE, Ke FENG, Xianghe ZENG, Ruifeng TANG, Jiarui ZOU, Zhaoxi HU, Fan LIN
  • Patent number: 11045051
    Abstract: The present disclosure discloses a blade seat assembly including a blade assembly, a clasp assembly, and a blade seat. The blade assembly includes a blade and a shaft, the blade being connected to one end of the shaft. The blade seat defines a mounting groove, and the other end of the shaft detachably is connected to the mounting groove via the clasp assembly. The present disclosure also provides a blending cup assembly and a food processor, which use the blade seat assembly. The technical scheme of the present disclosure aims to enable the blade assembly to be disassembled.
    Type: Grant
    Filed: February 19, 2019
    Date of Patent: June 29, 2021
    Assignee: GUANGDONG MIDEA CONSUMER ELECTRICS MFG CO., LTD.
    Inventors: Lei Zhu, Jianfei Xu, Weijie Chen, Xianghe Zeng, Li Xiao, Weijun Liu, Yan She
  • Patent number: 10786118
    Abstract: The present disclosure provides a food processor which includes a main engine, a stirring cup, and a cup cover assembly. A main control board is defined in the main engine and the stirring cup is mounted on the main engine. The cup cover assembly covers the stirring cup and the bottom of the stirring cup defines a heating device which electrically is connected to the main control board. The cup cover assembly includes an upper cover and an inner surface of the upper cover defines an anti-overflow detecting element, and the anti-overflow detecting element electrically is connected to the main control board. When a part of foam contacts the anti-overflow detecting element, the main control board controls the heating device to stop heating and no foam is generated, therefore preventing the foam liquid from overflowing the stirring cup.
    Type: Grant
    Filed: February 12, 2019
    Date of Patent: September 29, 2020
    Assignees: GUANGDONG MIDEA CONSUMER ELECTRIC MANUFACTURING CO., LTD., MIDEA GROUP CO., LTD.
    Inventors: Xianghe Zeng, Jianfei Xu, Weijie Chen, Yan She, Yan Tang
  • Patent number: 10786117
    Abstract: The present disclosure provides a food processor including a cutter head, on which a cutter is arranged; and a cup body arranged on the cutter head. The intersecting line of the side wall of the cutter head and the cross section of the cutter head is a cutter head contour line, the largest inscribed circle or the smallest circumscribed circle of the cutter head contour line is a cutter head base circle, and the central axis of the cutter head penetrates the center of the cutter head base circle. The intersecting line of the cup wall of the cup body and the cross section of the cup wall is a cup body contour line, the largest inscribed circle or the smallest circumscribed circle of the cup body contour line is a cup body base circle, and the central axis of the cup body penetrates the center of the cup body base circle.
    Type: Grant
    Filed: January 28, 2019
    Date of Patent: September 29, 2020
    Assignees: GUANGDONG MIDEA CONSUMER ELECTRICS MANUFACTURING CO., LTD., MIDEA GROUP CO., LTD.
    Inventors: Qian Fan, Xianghe Zeng, Jianfei Xu
  • Publication number: 20200284246
    Abstract: The present disclosure provides a vacuum pumping device and a food processor. The vacuum pumping device includes an upper cover; a lower cover configured to cooperated with the upper cover to form a receiving cavity and including a connecting part at a lower portion of the lower cover, a wall of the receiving cavity defining an evacuation hole and an exhaust hole; a mounting support located in the receiving cavity and connected to the upper cover and/or the lower cover; a vacuum pump connected to the mounting support, and including an air inlet communicating with the evacuation hole and an air outlet communicating with the exhaust hole; a control circuit board connected to the mounting support and electrically connected to the vacuum pump; and a power supply device located in the receiving cavity and electrically connected to the control circuit board.
    Type: Application
    Filed: August 7, 2018
    Publication date: September 10, 2020
    Inventors: Jianfei XU, Rong LIU, Dan WU, Xianghe ZENG, Yan TANG
  • Publication number: 20190174959
    Abstract: The present disclosure provides a food processor which includes a main engine, a stirring cup, and a cup cover assembly. A main control board is defined in the main engine and the stirring cup is mounted on the main engine. The cup cover assembly covers the stirring cup and the bottom of the stirring cup defines a heating device which electrically is connected to the main control board. The cup cover assembly includes an upper cover and an inner surface of the upper cover defines an anti-overflow detecting element, and the anti-overflow detecting element electrically is connected to the main control board. When a part of foam contacts the anti-overflow detecting element, the main control board controls the heating device to stop heating and no foam is generated, therefore preventing the foam liquid from overflowing the stirring cup.
    Type: Application
    Filed: February 12, 2019
    Publication date: June 13, 2019
    Inventors: Xianghe Zeng, Jianfei Xu, Weijie Chen, Yan She, Yan Tang
  • Publication number: 20190174961
    Abstract: The present disclosure discloses a blade seat assembly including a blade assembly, a clasp assembly, and a blade seat. The blade assembly includes a blade and a shaft, the blade being connected to one end of the shaft. The blade seat defines a mounting groove, and the other end of the shaft detachably is connected to the mounting groove via the clasp assembly. The present disclosure also provides a blending cup assembly and a food processor, which use the blade seat assembly. The technical scheme of the present disclosure aims to enable the blade assembly to be disassembled.
    Type: Application
    Filed: February 19, 2019
    Publication date: June 13, 2019
    Inventors: Lei ZHU, Jianfei XU, Weijie CHEN, Xianghe ZENG, Li XIAO, Weijun LIU, Yan SHE
  • Publication number: 20190150669
    Abstract: The present disclosure provides a food processor, comprising: a cutter head, wherein a cutter is arranged on the cutter head, the intersecting line of the side wall of the cutter head and the cross section of the cutter head is a cutter head contour line, the maximum inscribed circle or the minimum circumscribed circle of the cutter head contour line is a cutter head base circle, and the central axis of the cutter head penetrates the center of the cutter head base circle; and a cup body arranged on the cutter head, wherein the intersecting line of the cup wall of the cup body and the cross section of the cup wall is a cup body contour line, the maximum inscribed circle or the minimum circumscribed circle of the cup body contour line is a cup body base circle.
    Type: Application
    Filed: January 28, 2019
    Publication date: May 23, 2019
    Inventors: Qian FAN, Xianghe ZENG, Jianfei XU
  • Publication number: 20190150670
    Abstract: The present disclosure provides a food processor including a cutter head, on which a cutter is arranged; and a cup body arranged on the cutter head. The intersecting line of the side wall of the cutter head and the cross section of the cutter head is a cutter head contour line, the largest inscribed circle or the smallest circumscribed circle of the cutter head contour line is a cutter head base circle, and the central axis of the cutter head penetrates the center of the cutter head base circle. The intersecting line of the cup wall of the cup body and the cross section of the cup wall is a cup body contour line, the largest inscribed circle or the smallest circumscribed circle of the cup body contour line is a cup body base circle, and the central axis of the cup body penetrates the center of the cup body base circle.
    Type: Application
    Filed: January 28, 2019
    Publication date: May 23, 2019
    Inventors: Qian FAN, Xianghe Zeng, Jianfei Xu